Fully new LED (Light Emitting Diode) crystal grain detection technology

A detection technology and die technology, applied in the field of detection, can solve the problems of high machine cost and personnel cost, large demand for personnel and machine, long test time for a single chip, etc., to speed up the photoelectricity measurement speed and reduce Machine cost and labor cost, the effect of realizing mass production operations

Active Publication Date: 2015-07-29
山西高科华兴电子科技有限公司
View PDF5 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage of this method is that the test time of a single chip is long and the efficiency is low
If it is necessary to mee

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0007] First, the technical solution of the present invention is further elaborated.

[0008] A brand-new LED grain detection technology. A performance test probe is installed on the machine. First, the ESD unit probe is used to measure the antistatic ability of the chip. The ESD unit is an electrostatic discharge unit, and the antistatic performance is measured After the chip moves, in the process of chip movement, the movement of the chip is controlled by the servo driver, and the chip is placed directly under the SMU unit probe. The SMU unit is the source measurement unit, ensuring that the detection position of the SMU unit probe is consistent with the ESD unit The detection positions of the probes are the same, and the electrical properties of the chip are measured and recorded. When the SMU unit probes the electrical properties of the chip, all the data of the same chip are comprehensively recorded at the same time. The measurement time of the chip is shortened, and the ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a detection method, and aims to provide a crystal grain detection technology which is low in production cost and can greatly shorten the measurement time of a chip. According to a fully new LED (Light Emitting Diode) crystal grain detection technology, a performance test probe is additionally arranged on a table; firstly the electrostatic discharge capacity of the chip is measured by using an ESD (Electronic Static Discharge) unit probe; the chip after the antistatic property measurement moves; in a movement process of the chip, the movement of the chip is controlled through a servo driver; the chip is placed just below an SMU (Source Measure Unit) unit probe to guarantee that the detection position of the SMU unit probe is the same as the detection position of the ESD unit probe and measure and record the electric property of the chip; when the electric property of the chip is measured by the SMU unit probe, all data of the same chip is comprehensively recorded at the same time, so the measurement time of the chip is shortened, the production cost can be greatly reduced, the positions in two measurement processes are positioned at the same position of the chip, and extra damage is not caused to the appearance of the chip.

Description

technical field [0001] The invention is a detection method, and in particular relates to a brand-new LED crystal grain detection technology. Background technique [0002] In the process of testing the chip, the LED chip testing machine currently used first tests the antistatic ability of the chip, then measures the various electrical properties of the chip, and finally records all the measurement data of the chip; if the chip If the antistatic ability of the chip is not enough, give up measuring the electrical properties of the chip. The disadvantage of this method is that the test time of a single chip is long and the efficiency is low. If mass production is to be satisfied, there is a large demand for personnel and machines, resulting in extremely high machine costs and personnel costs. Contents of the invention [0003] The invention overcomes the shortcomings of the prior art and aims to provide a crystal grain inspection technology with low production cost and great...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): G01R31/26
Inventor 肖鹏春
Owner 山西高科华兴电子科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products