Substrate liquid processing apparatus and substrate liquid processing method

Abstract

Disclosed is a method for performing a liquid processing on a substrate using an aqueous solution of a chemical agent at a predetermined concentration as a processing liquid. The method includes: storing the processing liquid in a processing liquid storage unit; and supplying an aqueous solution of the chemical agent at a different concentration from the concentration of the processing liquid to the processing liquid storage unit, discharging the processing liquid from the processing liquid storage unit so as to update the processing liquid stored in the processing liquid storage unit. The aqueous solution in a predetermined amount is supplied to the processing liquid storage unit, and the processing liquid is discharged from the processing liquid storage unit, the processing liquid containing the chemical agent in the same amount as the amount of the chemical agent contained in the aqueous solution supplied to the processing liquid storage unit.

Description

technical field [0001] The present invention relates to a substrate liquid processing apparatus, a substrate liquid processing method, and a computer-readable recording medium in which a substrate liquid processing program is recorded, using an aqueous solution of a chemical having a predetermined concentration as a processing liquid for liquid processing a substrate. Background technique [0002] Conventionally, substrates such as semiconductor wafers and liquid crystal substrates are subjected to etching, cleaning, etc., using processing liquids such as etching liquids and cleaning liquids using substrate liquid processing equipment when manufacturing semiconductor components, flat panel displays, and the like. [0003] In the substrate liquid processing apparatus, an aqueous solution of a chemical having a predetermined concentration is used as a processing liquid, and the substrate is immersed in a processing tank storing the processing liquid or sprayed onto the surface ...

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Problems solved by technology

[0004] In the conventional substrate liquid processing apparatus, if the substrate is repeatedly processed using the processing liquid, the concentration of impurities and the like contained in the processing liquid increases due to the processing of the substrate, and the substrate cannot be processed satisfactorily.

For example, in the case of treating a substrate with an aqueous phosphoric acid solution (etching solution), since the capability (etching rate) of the treatment solution depends on the silicon concentration in the treatment solution, it is necessary to keep the silicon concentration in the treatment solution within a fixed range. However, the concentration of silicon in the etchant increases as the substrate is repeatedly processed, and the ability of the treatment solution decreases, so that the substrate cannot be etched satisfactorily (for example, refer to Patent Document 1).

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