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Electronic device

A technology for electronic equipment and power terminals, applied in circuits, printed circuits, electrical components, etc., can solve the problem of noise easily flowing to the ground layer, and achieve the effect of suppressing noise and improving electrical characteristics

Active Publication Date: 2015-08-19
RENESAS ELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Patent Document 2 also discloses that the first and second three-terminal capacitors are commonly grounded, so the noise flowing through the ground plane will produce an electromagnetic compensation effect, and noise will appear due to the reduction of ESL (Equivalent Series Inductance, equivalent series inductance) Phenomenon that tends to flow to the ground plane

Method used

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Deformed example 1

[0173] In the above embodiment, the semiconductor device SP1 in which the plurality of pads 2pd of the semiconductor chip 2 and the pads 3p1 of the wiring board 3 are electrically connected by the bonding wire BW has been described as an example. Figure 14 shown is image 3 A cross-sectional view of a modified example of the semiconductor device in .

Deformed example 2

[0175] In addition, in the above-mentioned embodiment, the example in which the plurality of bonding pads 2pd are arranged on the periphery (peripheral portion) of the quadrangular semiconductor chip 2 has been described, but the plurality of bonding pads 2pd may also be arranged on the entire surface of the semiconductor chip 2. 2a on. That is, since a plurality of bonding pads 2pd can also be arranged in the central portion of the surface 2a of the semiconductor chip 2, the length of wiring that couples the circuit formed on the semiconductor chip 2 with the bonding pads 2pd can be shortened, so that The high-speed operation of the semiconductor device SP2 and the electronic device ED1 is realized. Solder paste can also be used instead of the ball electrodes BE.

Deformed example 3

[0177] Next, modifications of the semiconductor device SP1 and the electronic device ED1 in Embodiment 1 will be described. Figure 15 Shown is an enlarged plan view of a part of the mounting surface of the semiconductor device SP3 of the electronic equipment ED3, and figure 1 correspond. Figure 16 Shown is a conductor pattern of the fourth wiring layer constituting the wiring substrate 3 of the semiconductor device SP3, and Figure 6B correspond. Figure 17 Shown is a conductor pattern constituting the first wiring layer of the mounting board MB3 of the electronic device ED3, and Figure 7 correspond. Figure 15 , Figure 16 and Figure 17 In the description of , omit the corresponding figure 1 , Figure 6B and Figure 7 Description of the same part of , only the different content is explained.

[0178] Such as Figure 16 As shown, the power supply pad 3p2(p) and the ground pad 3p2(g) are arranged on the pad 3p2 located at the corner of the wiring board 3. As shown...

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Abstract

To improve electric characteristics of an electronic device. An electronic device includes a semiconductor device and a three-terminal capacitor mounted on the upper surface of a mounting substrate, the semiconductor device includes a power supply pad and a ground pad, the power supply pad and the ground pad are electrically connected with a power supply land and a ground land, respectively, and the power supply land and the ground land are allocated to a land line in an outermost periphery of the semiconductor device, Then, the power supply land and the ground land are electrically connected to the three-terminal capacitor by wirings formed on the upper surface of the mounting substrate.

Description

technical field [0001] The present invention relates to an electronic device, for example, an electronic device in which a plurality of electronic components (semiconductor devices, capacitors) are mounted on a wiring board (main board). Background technique [0002] In electronic equipment constituting an electronic circuit, a plurality of capacitors (capacitor elements) are mounted in addition to semiconductor devices. [0003] Patent Document 1 (Japanese Unexamined Patent Publication No. 2007-305642) discloses an electronic device in which a microcomputer (supporting the above-mentioned semiconductor device) is mounted on a main surface of a multilayer circuit board (supporting a mounting substrate described later). A three-terminal capacitor for reducing unnecessary radiation noise and an auxiliary capacitor (two-terminal capacitor or three-terminal capacitor) for voltage suppression are mounted on the back surface of the multilayer circuit board. The microcomputer is e...

Claims

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Application Information

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IPC IPC(8): H01L23/488H01L23/498H01L21/60
CPCH05K1/181H05K1/0231H01L2224/05554H01L2224/16225H01L2224/48095H01L2224/48227H01L2924/15311H01L2924/181H05K1/025H05K2201/10545H01L2924/00012
Inventor 远山仁博诹访元大
Owner RENESAS ELECTRONICS CORP
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