Circuit device used for back contact solar module and preparation method

Abstract

The invention discloses a method for preparing a circuit device used for a back contact solar module. The method includes the steps of: manufacturing a perforated insulating adhesive film 3; gluing a copper foil, an aluminum foil or another metal foil with excellent conductivity to the perforated insulating adhesive film 3; machining in a position in a hole of the perforated insulating adhesive film 3 to generate an electrode cluster point, wherein the thickness of the electrode cluster point 4 does not exceed that of the perforated insulating adhesive film 3, and the electrode cluster point 4 is electrically connected with positive and negative poles of a silicon wafer of the solar module through a conductive silver adhesive; machining the metal foil to generate a circuit; and gluing a solar module back plate on the other side of the metal foil. The invention also provides a product produced by the abovementioned method. The method and the product provided by the invention improve ohmic contact performance of a back contact solar cell flexible circuit device, remarkably saves the usage amount of the conductive silver adhesive, and can improve a conductive effect and machining efficiency and reduce machining cost of the circuit device used for the back contact solar module.

Description

technical field [0001] The invention relates to the field of high-efficiency back-contact solar cells, in particular to a circuit device for back-contact solar modules and a preparation method thereof. Background technique [0002] Traditional flexible circuit devices for back-contact solar cells use copper foil or aluminum foil to make flexible circuit boards. Since oxides or other pollutants are easily produced on the surface of metal materials, the contact resistance between the battery sheet and the flexible circuit board will be increased; larger The contact resistance will cause the flexible circuit device to be unqualified, and the lower contact resistance will reduce the power output of the solar cell module, and the contact point of the electrode will heat up. This heat will continue to affect the weather resistance of the conductive silver glue and the packaging material and accelerate its aging. Serious The battery chip will completely lose contact with the flexib...

AI Technical Summary

Problems solved by technology

[0002] Traditional flexible circuit devices for back-contact solar cells use copper foil or aluminum foil to make flexible circuit boards. Since oxides or other pollutants are easily produced on the surface of metal materials, the contact resistance between the battery sheet and the flexible circuit board will be increased; larger The contact resistance will cause the flexible circuit device to be unqualified, and the lower contact resistance will reduce the power output of the solar cell module, and the contact point of the electrode will heat up. This heat will continue to affect the weather resistance of the conductive silver glue and the packaging material and accelerate its aging. Serious The battery will completely lose contact with the flexible circuit board, causing component failure

[0003] If aluminum foil is used as the basic material of the circuit device, the oxidation of the surface is very serious. The main reason is that the nature of the aluminum element is very active, and the surface is more likely to be oxidized. As a result, the contact resistance on the surface of the aluminum foil will basically not be lower than 100 milliohms, which seriously affects The performance of the circuit device

[0004] During the production process, transportation and storage of copper foil, certain oxides will be produced on the surface due to contact with air and water vapor. In addition, some copper foils will be coated with anti-oxidation coatings before leaving the factory. The process will be slower and less serious than aluminum, but these oxides and coatings will also lead to an increase in the contact resistance on the surface of the copper foil, basically the contact resistance will be about 1 milliohm

[0005] In addition, the flexible circuit device used in the traditional back-contact solar cell has no electrode cluster points in the hole of the perforated insulating film, and the back-contact component uses expensive conductive silver glue to connect the positive and negative poles of the cell to the flexible circuit. The direct electrical connection of the circuit board, so the thickness of the perforated insulating adhesive film determines the amount of conductive silver adhesive used. Since the thickness of the insulating adhesive film is relatively thick, the amount of conductive silver adhesive used will increase virtually, increasing the number of components. Package cost

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