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A device for containing etching solution

A technology of etching liquid and equipment, applied in the field of equipment containing etching liquid, can solve problems such as corrosion, difficult etching, unfavorable metal resist layer, etc., and achieve the effect of avoiding precipitation and simple operation

Active Publication Date: 2017-10-27
CHENGDU HONGHUA ENVIRONMENTAL SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] When the pH value of the etching solution drops below 8.0, on the one hand, it is unfavorable to the metal anti-corrosion layer; Forms slimy deposits that can form a crust on the heater, potentially damaging the heater, and clog pumps and nozzles, making etching difficult
Only by constantly stirring the etching solution to keep the etching solution moving, to prevent the solution from settling, when it is necessary to use the etching solution to etch the circuit board, the etching solution can be released. At present, most of the etching solution is stirred by a stirrer, but the stirrer The structure is complex, and the stirring blade solution on it is corroded by the etching solution, so it is not popularized.

Method used

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  • A device for containing etching solution

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Embodiment Construction

[0011] The present invention will be further described below in conjunction with accompanying drawing, protection scope of the present invention is not limited to the following:

[0012] like figure 1 As shown, a device for containing etching liquid, which includes a machine base 1, a storage tank 2 and a controller, the machine base 1 is provided with a column 3 and an oil cylinder 4, and the column 3 and the oil cylinder 4 are arranged perpendicular to the machine base 1 , the top of the column 3 is provided with a hinge seat 5, the storage tank 2 is arranged between the column 3 and the oil cylinder 4, the two sides of the storage tank 2 are respectively provided with a rotating shaft I6 and a rotating shaft II7, and the rotating shaft I6 and the rotating shaft II7 are arranged symmetrically with respect to the storage tank 2 , the other end of the rotating shaft I6 is hinged on the hinge seat 5, and the other end of the rotating shaft II7 is hinged on the active end of the...

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Abstract

The invention discloses a novel device for storing etching liquid. The device comprises a stand (1), a storing tank (2) and a controller, wherein the storing tank (2) is arranged between the vertical column (3) and an oil cylinder (4); a rotating shaft I (6) and a rotating shaft II (7) are respectively arranged at two sides of the storing tank (2); the other end of the rotating shaft I (6) is hinged to a hinge seat (5); the other end of the rotating shaft II (7) is hinged to the acting end of a piston rod of the oil cylinder (4); a liquid inlet (9) and a liquid outlet (10) are both communicated with a cavity (8) and are both connected with two-position two-way electromagnetic reversing valves (11); a plurality of air inlets (12) communicated with the cavity (8) are formed in two sidewalls of the storing tank (2); the controller is connected with the oil cylinder (4) and the two two-position two-way electromagnetic reversing valves (11). The device has the beneficial effects of being small in manufacturing cost, and simple to operate, and effectively avoiding deposition of the etching liquid.

Description

technical field [0001] The invention relates to the technical field of preventing precipitation of etching solution, in particular to a device for containing etching solution. Background technique [0002] At present, during the etching process of the circuit board, the etching solution corrodes the copper strips on the circuit board. With the continuous dissolution of the copper material, the specific gravity of the solution continues to increase. When the specific gravity exceeds a certain value, the ammonium chloride and ammonia water system will automatically compensate. Etching solution, adjust the specific gravity to an appropriate range. Generally, the specific gravity is controlled at 18~240Be. The influence of the pH value of the solution The pH value of the etching solution should be kept between 8.0 and 8.8. [0003] When the pH value of the etching solution drops below 8.0, on the one hand, it is unfavorable to the metal anti-corrosion layer; Slimey deposits a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23F1/08
Inventor 韦建敏赵兴文张晓蓓张小波
Owner CHENGDU HONGHUA ENVIRONMENTAL SCI & TECH CO LTD