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Method for manufacturing LED chip of vertical structure

An LED chip, vertical structure technology, applied in manufacturing tools, laser welding equipment, electrical components, etc., can solve problems such as inconvenient operation, large limitations, and difficulty in meeting production needs, to improve yield, reduce damage, and eliminate The effect of the restriction on the scribe line alignment

Active Publication Date: 2015-09-02
ENRAYTEK OPTOELECTRONICS
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  • Abstract
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Problems solved by technology

However, this method is not convenient to operate, and with the diversification of LED structures and sizes, the limitations of this method are increasing, making it difficult to meet production needs.

Method used

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  • Method for manufacturing LED chip of vertical structure
  • Method for manufacturing LED chip of vertical structure
  • Method for manufacturing LED chip of vertical structure

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Embodiment Construction

[0026] The method for manufacturing the vertical structure LED chip of the present invention will be described in more detail below in conjunction with schematic diagrams, wherein a preferred embodiment of the present invention is shown, and it should be understood that those skilled in the art can modify the present invention described here and still realize the present invention beneficial effect. Therefore, the following description should be understood as the broad knowledge of those skilled in the art, but not as a limitation of the present invention.

[0027] In the interest of clarity, not all features of an actual implementation are described. In the following description, well-known functions and constructions are not described in detail since they would obscure the invention with unnecessary detail. It should be appreciated that in the development of any actual embodiment, numerous implementation details must be worked out to achieve the developer's specific goals, ...

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Abstract

The invention discloses a method for manufacturing an LED chip of vertical structure. The method comprises the steps of providing a front-end structure composed of a first substrate and a functional layer formed on the front of the first substrate; providing a second substrate which is bonded with the front-end structure through the functional layer; and illuminating the front-end structure by using a laser beam with a light spot of less than or equal to 150<mu>m so as to lift the first substrate off. As the adopted light spot is relatively small, damage to the front-end structure in the lift-off is reduced, and thus the improvement in the yield of the prepared LED chip of vertical structure can be facilitated. In addition, the alignment limitation of a scribe line in the lift-off is eliminated, and the operability of the laser lift-off process is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a method for manufacturing a vertical structure LED chip. Background technique [0002] As we all know, due to the constraints of non-conductivity and poor thermal conductivity of the sapphire substrate, the traditional front-mount LED chip has inherent defects such as uneven current distribution and poor heat dissipation. In order to overcome these shortcomings of the front-mounted structure LED chips, the industry is actively developing vertical structure LEDs (hereinafter referred to as V-LEDs). V-LED adopts Si or metal substrate with high conductivity and good heat dissipation, so that the substrate has good heat conduction, the problem of PN junction heat dissipation is solved, and large-scale power chips can be realized. [0003] V-LED is a research hotspot of light-emitting semiconductor devices. After years of development, the relatively mature preparation technol...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00
CPCB23K26/00H01L33/00H01L33/005
Inventor 吕孟岩张宇李起鸣徐慧文
Owner ENRAYTEK OPTOELECTRONICS
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