A circuit floating installation structure

Abstract

The present invention relates to the technical field of heat conduction of electronic equipment, and in particular to a circuit floating installation structure. A circuit floating installation structure includes: a support frame, on which at least one set of reverse thread mechanisms that can float up and down is correspondingly installed, The arbitrary set of reverse thread mechanisms includes two oppositely installed reverse thread assemblies, and at least one set of spaced circuit boards and heat sinks are installed between the two oppositely installed reverse thread assemblies. When the cooling plate moves to a set height under the drive of the reverse screw mechanism, it abuts against the bulkhead of the electronic compartment where it is located. It can semi-automatically and quickly adjust the relative position of the circuit board and the heat sink, promote good contact between the radiator and the inner wall of the electronic compartment, and make the electronic equipment better adaptable to the thermal environment. At the same time, it can increase the distance between the circuit board and the electronic compartment at the beginning of installation. The gap reduces the difficulty of installation, narrows the gap between the circuit board and the electronic compartment, and facilitates heat dissipation.

Description

Technical field [0001] The invention relates to the technical field of thermal conduction of electronic equipment, in particular to a circuit floating mounting structure. Background technique [0002] With the continuous development of electronic assembly technology, the volume of electronic equipment tends to be miniaturized, the system tends to become more complex, and high thermal density has become an irresistible development trend. In order to meet the needs of high heat density, traditional heat dissipation methods such as fans and radiators are constantly being introduced, and new and efficient heat dissipation methods are emerging one after another. [0003] As we all know, the basic methods of internal heat transfer in electronic devices are: heat conduction, convection and thermal radiation. They can appear alone or in two or three forms at the same time. When the heating density of the components exceeds 0.6W / cm2, the lead legs of the components and the components thems...

AI Technical Summary

Problems solved by technology

[0004] In the existing circuit installation structure, the circuit board and the radiator are fixed on a support structure, and the positions of the circuit board and the radiator and their mutual positions are not adjustable, so it is difficult to ensure good contact between the radiator and the inner wall of the electronic cabin. It blocks the thermal conduction path of electronic components and cannot meet the thermal design requirements of electronic equipment

[0005] At the same time, because the positions of the circuit board and the radiator and their mutual positions are not adjustable, it is difficult to install the circuit board, radiator and supporting structure during installation, which increases the difficulty of installation.

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