Chip positioning clamp of vacuum eutectic soldering, manufacturing method and chip transferring method
A positioning fixture and eutectic welding technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as affecting microwave power, and achieve the effects of improving position accuracy, reducing process time, and not easily deformed
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Example Embodiment
[0058] Example 1 :
[0059] Combine figure 1 -Figure 4, this embodiment describes in detail the positioning fixture for vacuum eutectic welding of the present invention, such as figure 1 Shown is a sectional view of the positioning fixture, such as figure 2 Shown as a top view, it includes: a substrate 1, a supporting step 2 and a limit step 3, wherein: the substrate 1 is provided with suction holes 11 for sucking chips; the supporting step 2 is located on the surface area of the substrate, To support the chip; the limit step 3 is located on the surface area of the support step away from the substrate and is used to limit the movement of the chip.
[0060] The positioning fixture of this embodiment is a positioning fixture for GaAs bare chips. The substrate 1 is a rectangular ceramic sheet slightly larger than the chip, and the suction hole 11 is located at the center of the substrate 1. The supporting step 2 includes a first frame 21 and an island 22 , The first frame 21 i...
Example Embodiment
[0063] Example 2 :
[0064] Combine Figure 5 -Figure 6, this embodiment describes in detail the manufacturing method of the chip positioning fixture of the present invention, such as Figure 5 As shown, it includes the following steps:
[0065] S71: forming a supporting step on the surface of the substrate;
[0066] S72: Form a limit step on the support step;
[0067] S73: Process a suction hole in the center of the substrate.
[0068] Wherein: Step S71 further includes:
[0069] S711: Provide a substrate, clean a surface of the substrate, and sputter a copper seed layer. The cross-sectional view of the corresponding positioning fixture is as follows Figure 6A Shown
[0070] S712: On the surface of the copper seed layer, an electroforming mask supporting the steps is formed by SU8 resist photolithography. The cross-sectional view of the corresponding positioning fixture is as follows Figure 6B Shown
[0071] S713: Electroforming nickel on the surface of the copper seed layer to form th...
Example Embodiment
[0078] Example 3 :
[0079] Combine Figure 7 This embodiment describes in detail the chip transport method of the present invention, which includes the following steps:
[0080] S111: The tip sucks the chip positioning fixture;
[0081] S112: The tip sucks the chip into the limit step of the chip positioning fixture through the suction hole;
[0082] S113: Move the chip to a suitable position in the packaging box;
[0083] S114: Remove the suction head, and install a pressure rod above the substrate of the chip positioning fixture.
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