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Chip positioning clamp of vacuum eutectic soldering, manufacturing method and chip transferring method

A positioning fixture and eutectic welding technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as affecting microwave power, and achieve the effects of improving position accuracy, reducing process time, and not easily deformed

Active Publication Date: 2015-09-09
SHANGHAI SPACEFLIGHT ELECTRONICS & COMM EQUIP RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The accumulated position deviation is relatively large, but the microwave has high requirements on the collinearity of the signal lines. The line angle to be measured is within ±2°, and the distance difference is within ±0.1mm. If it exceeds, it will directly affect the microwave power.

Method used

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  • Chip positioning clamp of vacuum eutectic soldering, manufacturing method and chip transferring method
  • Chip positioning clamp of vacuum eutectic soldering, manufacturing method and chip transferring method
  • Chip positioning clamp of vacuum eutectic soldering, manufacturing method and chip transferring method

Examples

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Embodiment 1

[0059] combine figure 1 - Fig. 4, this embodiment describes in detail the positioning fixture of the vacuum eutectic welding of the present invention, as figure 1 Shown is a cutaway view of the positioning fixture, as figure 2It is shown in a top view, which includes: a substrate 1, a support step 2 and a limit step 3, wherein: the substrate 1 is provided with an adsorption hole 11 for absorbing chips; the support step 2 is located on the surface area of ​​the substrate, and For supporting the chip; the limit step 3 is located on the surface area of ​​the support step away from the substrate, and is used to limit the movement of the chip.

[0060] The positioning fixture of this embodiment is a positioning fixture for GaAs bare chips, the substrate 1 is a rectangular ceramic sheet slightly larger than the chip, and the adsorption hole 11 is located at the center of the substrate 1; the supporting step 2 includes a first frame 21 and an island 22 , the first frame 21 is a ...

Embodiment 2

[0064] combine Figure 5 - Fig. 6, this embodiment describes in detail the manufacturing method of the chip positioning jig of the present invention, as Figure 5 shown, which includes the following steps:

[0065] S71: forming a support step on the surface of the substrate;

[0066] S72: forming a limit step on the support step;

[0067] S73: Machining an adsorption hole at the center of the substrate.

[0068] Wherein: Step S71 further includes:

[0069] S711: Provide a substrate, clean one surface, and sputter a layer of copper seed layer, and the cross-sectional view of the corresponding positioning fixture is as follows Figure 6A shown;

[0070] S712: An electroformed mask for supporting steps is formed on the surface of the copper seed layer by photolithography with SU8 glue, and the sectional view of the corresponding positioning fixture is as follows Figure 6B shown;

[0071] S713: Nickel is electroformed on the surface of the copper seed layer to form the fir...

Embodiment 3

[0079] combine Figure 7 , this embodiment describes in detail the chip transfer method of the present invention, which includes the following steps:

[0080] S111: the suction head sucks the chip positioning fixture;

[0081] S112: the suction head adsorbs the chip on the limit step of the chip positioning fixture through the adsorption hole;

[0082] S113: moving the chip to a suitable position in the packaging box;

[0083] S114: Remove the suction head, and install a pressure rod above the substrate of the chip positioning jig.

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Abstract

The invention discloses a position clamp of vacuum eutectic soldering, a manufacturing method and a chip transferring method. The positioning clamp comprises a substrate, a supporting step and a limiting step. The substrate is provided with an adsorbing hole. The supporting step is used for supporting a chip. The limiting step is used for limiting the chip. The manufacturing method comprises the steps of: forming the supporting step on the surface of substrate; forming the limiting step on the surface of the supporting step; and manufacturing the adsorbing hole on the center position of the substrate. The chip transferring method comprises the steps that an adsorbing head adsorbs the chip positioning clamp; the adsorbing head adsorbs the chip into the limiting step of the chip positioning clamp through the absorbing hole; the chip is moved to a suitable position in a packaging box; and the adsorbing head is dismounted, and a pressure rod is installed. By adopting the positioning clamp, the manufacturing method and the chip transferring method, the chip transferring process is simplified, the processing time is saved, the position tolerance in the chip transferring process is reduced, and the position precision is improved.

Description

technical field [0001] The invention relates to the field of semiconductor packaging, in particular to a chip positioning jig for vacuum eutectic welding, a manufacturing method and a chip transfer method. Background technique [0002] The T / R component is the core part of the phased array radar, and it mainly plays the role of sending, receiving and amplifying microwave signals in the radar. At present, the assembly of T / R components mostly adopts multi-chip assembly and assembly technology, in which the chip is installed and fixed using chip eutectic technology. The chip in the T / R module is mainly a microwave high-power chip, which has high requirements on the heat dissipation and grounding performance of the substrate. The chip eutectic technology can well meet the above requirements. Chip eutectic technology adds solder between the bottom of the chip and the substrate, and realizes the eutectic fusion of the two surfaces through appropriate temperature, time, pressure ...

Claims

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Application Information

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IPC IPC(8): H01L21/68H01L21/683
CPCH01L21/68H01L21/683
Inventor 周义刘米丰曹向荣符容
Owner SHANGHAI SPACEFLIGHT ELECTRONICS & COMM EQUIP RES INST
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