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A printed circuit board acid etching liquid waste gas absorption device

A technology of acid etching solution and printed circuit board, which is applied in the field of waste gas absorption device of acid etching solution for printed circuit board, which can solve the problems of excessive discharge, unstable composition, irritating odor, etc., and achieve the effect of reducing usage and improving etching efficiency

Active Publication Date: 2017-09-22
SHENZHEN JECH TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This treatment method has the following defects: 1) consumes a large amount of strong alkali solution, produces a large amount of wastewater, and increases the difficulty of wastewater treatment; 2) the solution that has absorbed chlorine gas has a pungent smell, and the composition is unstable, and it is easy to decompose when exposed to light; 3) The absorption effect of the waste gas tower is limited, and it is prone to excessive discharge

Method used

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  • A printed circuit board acid etching liquid waste gas absorption device
  • A printed circuit board acid etching liquid waste gas absorption device
  • A printed circuit board acid etching liquid waste gas absorption device

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Embodiment Construction

[0023] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0024] see figure 1 and figure 2 As shown, the waste gas absorption device for acidic etching solution for printed circuit boards provided by the present invention is used to absorb waste gas generated during the electrolysis process of acidic etching waste liquid for printed circuit boards, and the waste gas absorption device for acidic etching liquid for printed circuit boards includes a cylinder 100 . The jet absorbing mechanism 200 and the heating mechanism 300. The jet absorbing mechanism 200 is installed in the middle of the rear end of the cylinder 100 , and the heating mechanism 300 is a...

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Abstract

The invention provides an acidic etching liquid exhaust gas absorption device for printed circuit boards, which includes a cylinder body, a jet absorption mechanism and a heating mechanism. The cylinder body includes two oppositely arranged first side plates and second side plates, and two oppositely arranged The third side plate and the fourth side plate, the cylinder body along the direction of the first side plate and the second side plate, from the fourth side plate to the third side plate includes balance cylinder, collecting Cylinder, jet cylinder, heating cylinder, adding cylinder and circulation cylinder, the jet cylinder is set opposite to the heating cylinder, the jet absorbing mechanism is installed at the rear end of the jet cylinder, and the heating mechanism is accommodated in the heating cylinder; the above structure, using the etching solution produced in the production process of the etching machine to absorb chlorine gas, not only has the effect of treating chlorine gas, but also can improve the ORP of the etching solution, improve the etching efficiency of the printed circuit board, and reduce the use of oxidants; Automatic addition, automatic heating and temperature control of etching solution and online circulation regeneration.

Description

technical field [0001] The invention belongs to the technical field of circuit board acid etching liquid, and in particular relates to a printed circuit board acid etching liquid waste gas absorbing device for absorbing waste gas generated during the electrolysis process of the acid etching waste liquid of the printed circuit board. Background technique [0002] Printed circuit board (PCB board), also known as printed circuit board, uses an insulating board as the base material and cuts it to a certain size. At least one conductive pattern is attached to it as the substrate, and holes (such as component holes) are provided on the upper part of the substrate. , strong holes, metal holes and other mounting holes), used to replace the chassis of electronic components installed in the past, and realize the electrical connection between component pins through conductive patterns, pads and metallized vias on the substrate. As the most basic and core component of electronic product...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23F1/46
Inventor 李建光
Owner SHENZHEN JECH TECH