Manufacturing method of fingerprint identification module

A technology of a fingerprint identification module and a manufacturing method, which are applied in character and pattern recognition, acquisition/organization of fingerprints/palmprints, manufacturing/assembly of piezoelectric/electrostrictive devices, etc., can solve high labor costs and large time costs and other problems, to achieve the effect of improving production speed, reducing time cost and labor cost

Active Publication Date: 2015-09-16
INTERFACE TECH CHENGDU CO LTD +1
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

At present, the manufacturing process of this type of ultrasonic sensor is usually to form a plurality of substrates respectively, and then respectively bond the first piezoelectric layer and the second piezoelectric layer to the two opposite sides of the substrate, which leads to the manufacturing process of the ultrasonic sensor. Requires a large time cost and high labor cost

Method used

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  • Manufacturing method of fingerprint identification module
  • Manufacturing method of fingerprint identification module
  • Manufacturing method of fingerprint identification module

Examples

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Embodiment Construction

[0019] figure 1 is a perspective view of the fingerprint recognition module 100 provided by the present invention, figure 2 for figure 1 For an exploded schematic diagram of the fingerprint identification module 100 in China, please refer to figure 1 and figure 2 . The fingerprint identification module 100 is used to electrically connect with a signal transmission module (not shown), the fingerprint identification module 100 is used to identify fingerprints placed on its surface, and form image information corresponding to user fingerprints transmitted to the signal transmission module, and the signal transmission module outputs the image information received from the fingerprint identification module 100 to other external functional modules, such as an image display module and the like. In this embodiment, the fingerprint recognition module 100 is an ultrasonic fingerprint recognition module 100 .

[0020] The fingerprint identification module 100 includes a substrate,...

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Abstract

A fingerprint identification module comprises a substrate, a first piezoelectric layer disposed on one side of the substrate and a second piezoelectric layer disposed on the other side of the substrate. The invention provides a manufacturing method of the fingerprint identification module. A first film forming a plurality of the first piezoelectric layers and a second film forming a plurality of the second piezoelectric layers are respectively formed on a first transshipment substrate and a second transshipment substrate firstly, cutting of the first film and cutting of the second film are respectively performed so that the first film is cut into a plurality of first film units and the second film is cut into a plurality of second film units, the first film units and the second film units are respectively attached to a mother substrate containing a plurality of the substrates to form one body, and then cutting is performed on the one body so that a plurality of the fingerprint identification modules are formed in one time. The manufacturing speed is effectively improved, and, correspondingly, time cost and human cost are reduced.

Description

technical field [0001] The invention relates to a manufacturing method of a fingerprint recognition module, in particular to a manufacturing method of an ultrasonic fingerprint recognition module. Background technique [0002] With the development of science and technology, the user-friendly fingerprint identification encryption protection function has been gradually integrated into electronic products to replace the traditional character password encryption function. A typical matter-wave sensing element is an ultrasonic sensor, which includes a substrate, a first piezoelectric layer formed on one side of the substrate, and a second piezoelectric layer formed on the other side of the substrate and opposite to the first piezoelectric layer . At present, the manufacturing process of this type of ultrasonic sensor is usually to form a plurality of substrates respectively, and then respectively bond the first piezoelectric layer and the second piezoelectric layer to the two op...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K9/00
CPCY10T29/42G06V40/1306H10N30/073H10N30/088H10N30/05
Inventor 王娟
Owner INTERFACE TECH CHENGDU CO LTD
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