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Hot melt adhesive composition for bookbinding

A composition and hot-melt adhesive technology, applied in the direction of adhesives, adhesive types, polyurea/polyurethane adhesives, etc., can solve the problem of adhesives sticking to cutters, polluting binding machines, and slow curing of hot-melt adhesives And other issues

Inactive Publication Date: 2015-09-30
株式会社五公 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In such cases, the ethylene-vinyl acetate-based hot-melt adhesives commonly used for bookbinding are slow to cure and can cause the adhesive to stick to cutters or the like, thereby contaminating the binding machine

Method used

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  • Hot melt adhesive composition for bookbinding
  • Hot melt adhesive composition for bookbinding
  • Hot melt adhesive composition for bookbinding

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] In the reactor, add 100 parts by weight of polyols, wherein the polyether polyols with a weight average molecular weight of 2000 and the polyester polyols with a weight average molecular weight of 3500 are mixed 1:1 in parts by weight, 20 The styrene-ethylene-butadiene-styrene copolymer of parts by weight, the glyceride of 40 parts by weight, the dipropylene glycol dibenzoate of 4 parts by weight, the calcium oxide of 2 parts by weight, the phenolic antibiotic of 2 parts by weight The oxidizing agent (ANOX-20) and 2 parts by weight of benzophenone were then stirred for 90 minutes while heating the reactor to 120°C. Next, 40 parts by weight of methylene diphenyl isocyanate was added to the stirred mixture, and the mixture was polymerized at 120° C. for 90 minutes. After the polymerization reaction, the bubbles of the polymerization product were removed in a vacuum, and the pressure of the reactor was adjusted at 760 mmHg, thereby preparing a hot-melt adhesive composition...

Embodiment 2

[0048] Except that 35 parts by weight of glyceride and 8 parts by weight of dipropylene glycol dibenzoate were mixed, the method for preparing the hot-melt adhesive composition for bookbinding in Example 2 was the same as that in Example 1.

Embodiment 3

[0050] Except that 30 parts by weight of glyceride and 12 parts by weight of dipropylene glycol dibenzoate were mixed, the method for preparing the hot-melt adhesive composition for bookbinding in Example 3 was the same as that in Example 1.

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PUM

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Abstract

The present invention relates to a hot melt adhesive composition for bookbinding, which specifically includes polyol, methylene diphenyl isocyanate, a thermoplastic rubber, an adhesive resin, a plasticizer, an antifoamer, an antioxidation agent, and an ultraviolet stabilizer. The hot melt adhesive composition for bookbinding consisting of the component has excellent temperature resistance to maintain the properties even at the low temperature, and has excellent wear resistance, impact resistance, and flexibility to allow a bound book to be opened in 360° without separation of the binding. Also, the composition has high solidifying speed to have an effect of not smearing a bookbinder during a bookbinding process.

Description

technical field [0001] The present invention relates to a hot-melt adhesive composition for bookbinding, in particular, the hot-melt adhesive composition for bookbinding maintains its physical properties at low temperatures because of its excellent temperature resistance, and because it also has excellent Excellent wear resistance, impact resistance and flexibility, so the inner pages of the book can be easily unfolded to 360° without opening the cover of the book, and it will not stick to the binding machine because of its rapid curing during the book binding process. Background technique [0002] Bookbinding usually involves applying adhesive to one side of a print and then attaching a cover to it. When the commonly used ethylene-vinyl acetate-based hot melt adhesive for bookbinding forms an adhesive layer with a thickness of 500 μm at a temperature of 0°C or lower, especially in winter, if the book is bumped, it will cause The problem that the adhesive layer of the book ...

Claims

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Application Information

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IPC IPC(8): C09J175/08C09J175/06C09J153/02C09J11/04C09J11/06
CPCC08L9/06C09J11/04C09J11/06C09J175/04
Inventor 刘昌俊洪仁五朴锺一
Owner 株式会社五公
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