An upside-down small-size high-power LED packaging structure

Abstract

The invention discloses a reverse-buckling type small-dimension large-power LED packaging structure including an LED lamp bead main body and a circuit board. The LED lamp bead main body includes a substrate, an LED chip, and a transparent plastic package body. The substrate is provided with two metal pads, the LED chip is fixedly welded on one of the metal pads and is communicated with the two metal pads through a gold wire, the transparent plastic package body covers the substrate and seals an LED chip and the gold wire therein, the circuit board is provided with a through hole having the diameter greater than the maximum width of the transparent plastic package body, the LED lamp bead main body is reversely buckled to the circuit board, the whole transparent plastic package body of the LED lamp bead main body is arranged in the through hole, and the substrate of the LED lamp bead main body is welded and fixed to the circuit board. Most of the heat generated by the LED chip is conducted to the circuit board through the metal pads, and then the heat is dispersed into air, the heat resistance is small, the heat radiation speed is fast, the heat radiation area is increased under limited dimension, so that a large-power LED lamp can be packaged in a small-dimension structure; and moreover, the heat radiation effect is good, and the cost is low.

Description

technical field [0001] The present invention relates to an LED package structure, more specifically to an upside-down small-size high-power LED package structure. Background technique [0002] The current LED packaging is developing towards small size, light and thin, and at the same time requires higher and higher power, and the heat flux density of LED chips is higher, so the heat dissipation requirements for packaging substrate materials are also getting higher and higher. [0003] The first method of the conventional LED packaging structure in the prior art is to use BT resin base material, cover the front and back sides with copper foil, and then make the positive and negative metal pads through etching, through-hole, electroplating and other processes. Die bonding and wire bonding operations are performed in the welding area, and then the chip is packaged with colloid to protect it. In the prior art, when the LED package uses a chip, the metal pad on the back of the p...

AI Technical Summary

Problems solved by technology

The disadvantage is that the metal pads of conventional LED packaging substrates are at the bottom, while the chip bonding area is on the front of the substrate. The heat generated when the chip is working needs to be dissipated through the packaging substrate, and the base material of the substrate has a large thermal resistance, which is not conducive to heat dissipation. Achieve medium and high power

[0004] The second method in the prior art is to use ceramic substrate packaging, and replace the conventional LED packaging substrate with a ceramic substrate. The other processes are the same as the conventional one, which can improve the heat dissipation capacity of the product, but the cost of the ceramic substrate is high, and the manufacturing accuracy of the current ceramic substrate is limited. , it is difficult to achieve small size

[0005] The third method in the prior art is to use PPA brackets to package and paste them backwards, such as figure 1 As shown, it includes a substrate 1, and a metal pad 2 is provided on the substrate 1, and a part of the metal pad passes through the substrate 1 and is integrated with the metal pad on the side of the substrate, and the LED chip 3 is solidly welded on the metal pad. , the metal pad and the circuit board 4 are welded by solder paste 5. This kind of PPA bracket package has the following disadvantages: first, the heat conduction path of the PPA reverse-mounted bracket is long, and it is difficult to achieve higher power; second, the current PPA bracket The production accuracy is limited, and it is difficult to achieve small size; the third is that the cost of PPA reverse mounting bracket is relatively high

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