Vapor Chamber with Structure having capillary force

Abstract

The present invention relates to a vapor chamber including a structure with a capillary force and, more particularly, to a vapor chamber including a structure with a capillary force capable of remarkably improving cooling performance by efficiently discharging heat generated in a portable electronic device with the great improvement of the capillary force by stacking metal powder with porosity through hardening after separation with a chemical method by stacking the metal powder on a porous structure when the porous structure is formed in a path between grooves or channels by forming a vapor structure to smooth the flow of an operating fluid in a longitudinal direction by forming the grooves or the channels on a top plate and a bottom plate comprising the chamber.

Description

technical field [0001] The present invention is a vapor chamber formed of a structure with capillary force. Specifically, grooves or grooves are formed on the upper plate and the lower plate constituting the heating plate to form an evaporation structure for smoother flow process, and a porous structure is formed on the channels formed between the grooves or grooves. This porous structure stacks the metal powder layer by layer, and after filtering out by chemical methods, the metal powder is made porous through solidification technology, which greatly improves the capillary force, helps portable electronic instruments to dissipate heat more effectively, and significantly improves their cooling. sex. Background technique [0002] Ordinary electronic products are designed to perform their functions at room temperature, so if the heat generated by electronic products cannot be dissipated in time, the electronic products will be overheated and their functions will be significan...

AI Technical Summary

Problems solved by technology

Brackets can be set separately on the upper / lower plates as needed, thus resulting in increased thickness of the vapor chamber, resulting in it not being thin enough

[0007] Second, the limitations of carbon gold plating in the vapor chamber

In addition, if carbon gold plating is attached to a large area, the performance of the vapor chamber will decrease, so there is also a limit to the area of ​​carbon gold plating.

The limitation of the carbon gold-plated attachment area results in a relatively small aspect ratio of the attachment area, and the heat in the vapor chamber will boil, and the function of evaporation and heat dissipation is limited.

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