Package structure embedded with passive electronic components and manufacturing method thereof

Abstract

The invention discloses a packaging structure embedded with passive electronic components, which includes a substrate, passive electronic components and a first conductive bridge. The substrate includes a first surface, a second surface disposed opposite to the first surface, an opening passing through the first surface and the second surface, and a first circuit layer and a second circuit layer respectively formed on the first surface and the second surface . The passive electronic component is disposed in the opening and has a first electrode pad exposed from the opening, and there is a gap between the passive electronic component and the substrate. The first conductive bridge connects the first electrode pad of the passive electronic component and the first circuit layer to bridge the gap, wherein the material of the first conductive bridge is conductive glue. According to the present invention, its process and materials are simple and easy to obtain, the conduction mode between passive components and circuits does not need to rely on laser blind holes, and the packaging structure can be applied to two-layer board products to reduce the thickness of the packaging substrate.

Description

technical field [0001] The invention relates to a packaging structure and a manufacturing method thereof, in particular to a packaging structure embedded with passive electronic components and a manufacturing method thereof. Background technique [0002] With the development of semiconductor packaging technology, in addition to the traditional wire bonding and flip chip semiconductor packaging technologies, different packaging types have been developed for semiconductor devices, such as directly embedding and embedding in the packaging substrate. Electrically integrating passive electronic components, this type of packaging can reduce the volume of the overall packaging structure and improve electrical functions, so it has become a packaging trend. [0003] In the current development trend of packaging substrates embedded with passive electronic components, laser blind holes are often used to conduct passive components and circuits. However, due to the limitations of the la...

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Problems solved by technology

However, due to the limitations of the laser blind via structure, this process is mainly applied to structures with more than four layers, so it is difficult to reduce the thickness of the package substrate embedded with passive electronic components

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