Insulation-layer mold-pressed structural member for extra-high-voltage direct-current power transmission and transformation and preparation method thereof
An ultra-high voltage DC and insulating layer technology, which is applied to the insulating layer, the insulating layer for ultra-high voltage DC power transmission and transformation, the molded structural parts, the molded structural parts and their preparation fields, which can solve the problems such as the difficulty in achieving the bending strength retention rate.
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Embodiment 1-1
[0054] At room temperature, add 30 parts of bisphenol A epoxy resin and 15 parts of 9,10-dihydro-9-oxo-10-phosphaphenanthrene-10-oxide modified epoxy resin into the glue tank. After stirring for 2 hours at 70°C, add 8 parts of inorganic flame retardant basic sodium aluminum carbonate, 12 parts of curing agent 4,4-diaminodiphenylmethane, 3 parts of phthalocyanine blue pigment, 32 parts of toluene, and stir 1 After the glue is fully dispersed and uniformly dispersed, add 0.02 parts of the accelerator 2-methylimidazole to adjust the molding time of the glue, take a sample, and test the molding time of the glue with a knife method (180℃ hot plate) for 480 seconds, and the glue will be prepared complete.
Embodiment 1-2
[0056] At room temperature, add 29 parts of bisphenol F epoxy resin and 17 parts of 9,10-dihydro-9-oxo-10-phosphaphenanthrene hydroquinone modified epoxy resin into the glue tank. After stirring for 1 hour at a temperature of ℃, add 10 parts of inorganic flame retardant aluminum hydroxide, 11 parts of curing agent 4,4-diaminodiphenyl sulfone, 1 part of titanium white pigment, 32 parts of ethylene glycol ethyl ether acetate, and stir 0.42 After being fully dispersed, add 0.01 part of the accelerator 2-ethyl-4-methylimidazole to adjust the molding time of the glue, take a sample, and test the molding time of the glue with a knife method (180℃ hot plate) for 510 seconds. The liquid is prepared.
Embodiment 1-3
[0058] At room temperature, add 32 parts of alicyclic epoxy resin and 17 parts of 9,10-dihydro-9-oxo-10-phosphaphenanthroquinone modified epoxy resin into the glue tank. At 125℃ After stirring for 1.5 hours, add 9 parts of inorganic flame retardant hydrotalcite, 10 parts of curing agent m-phenylenediamine, 3 parts of medium chrome yellow pigment, 29 parts of methyl acetate, and stir for 1 hour to make it fully dispersed and uniform, then add 0.02 parts of accelerator, boron trifluoride ethylamine, adjust the molding time of the glue, take a sample, test the molding time of the glue with a knife method (180°C hot plate) for 450 seconds, and the glue is prepared.
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