Insulation force-receiving member for ultra-high voltage direct current power transmission and transformation and preparation method thereof
A technology of ultra-high voltage DC and force-bearing parts, which is applied in the fields of motors and transformers, insulating structural force-bearing parts, insulating force-bearing parts for ultra-high voltage DC power transmission and transformation and the field of preparation thereof, which can solve the problem that the retention rate of bending strength is difficult to maintain. problems such as poor tracking resistance, poor tracking resistance, and inability to meet at the same time, to achieve significant practical use value and application prospects, excellent performance, high mechanical strength and electrical properties.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1-1
[0045] At room temperature, add 32 parts of bisphenol A epoxy resin and 17 parts of DOPO-DICY to the glue tank respectively, and after stirring for 1 hour at 105°C, add 10 parts of inorganic flame retardant sodium basic aluminum carbonate, tert- 12 parts of amine curing agent 4,4-diaminodiphenylmethane, 2 parts of phthalocyanine blue pigment, 27 parts of toluene, stir for 1 hour to make it fully dispersed, add 0.02 parts of accelerator 2-methylimidazole to adjust the glue The forming time of the glue is taken, and the forming time of the glue is tested by the knife method (180 ℃ hot plate) for 480 seconds, and the adhesive is prepared.
Embodiment 1-2
[0047] At room temperature, add 35 parts of bisphenol F epoxy resin and 15 parts of DOPO-DDM to the glue tank, stir at 75°C for 1 hour, add 6 parts of inorganic flame retardant aluminum hydroxide, tertiary amine to cure Agent 4, 12 parts of 4-diaminodiphenyl sulfone, 3 parts of titanium dioxide, 29 parts of xylene, stirred for 0.42 hours to make it fully dispersed, then added 0.02 parts of accelerator 2-ethyl-4-methylimidazole Adjust the molding time of the glue, take a sample, and use the knife method to test the molding time of the glue (180°C hot plate) for 520 seconds, and the adhesive is prepared.
Embodiment 1-3
[0049] At room temperature, add 31 parts of alicyclic epoxy resin and 12 parts of ODOPM-DDS to the glue tank respectively, and after stirring at 130°C for 1.5 hours, add 7 parts of inorganic flame retardant hydrotalcite and tertiary amine curing agent 10 parts of m-phenylenediamine, 2 parts of medium chrome yellow pigment, 38 parts of ethylene glycol ethyl ether acetate, stirred for 1 hour to make it fully dispersed, and then add 0.02 parts of boron trifluoride ethylamine to adjust the molding of the glue Time, sampling, test the molding time of the glue solution (180°C hot plate) for 450 seconds with a knife method, and the adhesive is prepared.
PUM
| Property | Measurement | Unit |
|---|---|---|
| bending strength | aaaaa | aaaaa |
| bending strength | aaaaa | aaaaa |
| bending strength | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 


