Insulation layer for UHV DC power transmission and transformation, molded structural part and preparation method thereof
A technology for UHV DC and insulating layers, which is applied in the fields of molded structural parts and their preparation, molded structural parts, insulating layers for UHV DC power transmission and transformation, and insulating layers, and can solve problems such as difficulty in achieving bending strength retention
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Embodiment 1-1
[0069] At room temperature, add 30 parts of bisphenol A type epoxy resin and 15 parts of 9,10-dihydro-9-oxo-10-phosphaphenanthrene-10-oxide modified epoxy resin into the glue tank respectively, After stirring at 70°C for 2 hours, add 8 parts of inorganic flame retardant sodium basic aluminum carbonate, 12 parts of curing agent 4,4-diaminodiphenylmethane, 3 parts of phthalocyanine blue pigment, 32 parts of toluene, and stir for 1 Hours, after making it fully dispersed, add 0.02 parts of accelerator 2-methylimidazole to adjust the molding time of the glue, take a sample, test the molding time of the glue with a knife method (180°C hot plate) for 480 seconds, and the glue is prepared complete.
Embodiment 1-2
[0071] At room temperature, add 29 parts of bisphenol F type epoxy resin and 17 parts of 9,10-dihydro-9-oxo-10-phosphaphenanthrene hydroquinone modified epoxy resin respectively in the compounding tank, at 130 After stirring at ℃ for 1 hour, add 10 parts of inorganic flame retardant aluminum hydroxide, 11 parts of curing agent 4,4-diaminodiphenyl sulfone, 1 part of titanium dioxide pigment, 32 parts of ethylene glycol ethyl ether acetate, and stir for 0.42 Hours, after fully dispersed evenly, add accelerator 2-ethyl-4-methylimidazole 0.01 part to adjust the molding time of the glue, take a sample, test the molding time of the glue with a knife method (180 ℃ hot plate) 510 seconds, glue The liquid is prepared.
Embodiment 1-3
[0073] At room temperature, respectively add 32 parts of cycloaliphatic epoxy resin and 17 parts of 9,10-dihydro-9-oxo-10-phosphaphenanthrenequinone modified epoxy resin into the compounding tank. After stirring at low temperature for 1.5 hours, add 9 parts of inorganic flame retardant hydrotalcite, 10 parts of curing agent m-phenylenediamine, 3 parts of medium chrome yellow pigment, 29 parts of methyl acetate, stir for 1 hour, make it fully dispersed, and then add The accelerator boron trifluoride ethylamine 0.02 part adjusts the molding time of the glue, takes a sample, and uses the knife method to test the molding time of the glue (180°C hot plate) for 450 seconds, and the glue is prepared.
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