Ion source maintenance device and ion source maintenance method

Abstract

The invention relates to the technical field of iron beam sputtering film plating, in particular to an ion source maintenance device and an ion source maintenance method. Through an insertion plate valve, an iron source maintenance cavity and a vacuum cavity are in separated arrangement; an iron source is maintained under the condition of not exposing the vacuum cavity into the atmosphere environment; the pollution of the vacuum cavity is avoided; in addition, an isolation protection sleeve is additionally added outside the iron source, so that a radio frequency iron source cannot interfere the normal movement of charged particles in the cavity; during the film plating process, the iron source can move inside the vacuum cavity; the target source distance can be regulated; the beam spot size and the beam flow space distribution are changed; further, the film deposition quality and the space distribution condition are regulated.

Description

technical field [0001] The invention relates to the technical field of ion beam sputtering coating, in particular to an ion source maintenance device and an ion source maintenance method. Background technique [0002] At present, the ion source used in the ion beam sputtering coating equipment is directly connected to the vacuum chamber. The ion source usually used for coating requires regular maintenance, which is divided into cleaning the quartz chamber (RF ion source) and replacing the resistance wire (DC ion source). The current maintenance method is to open the entire vacuum chamber, and maintain the ion source under the condition that the entire vacuum chamber is exposed to the atmosphere. Since the connection between the ion source and the vacuum chamber is fixedly connected by a flange or through a vacuum bellows, opening the vacuum chamber to maintain the ion source, and exposing the vacuum chamber to the atmospheric environment will cause a lot of air to adhere to...

AI Technical Summary

Problems solved by technology

Since the connection between the ion source and the vacuum chamber is fixedly connected by a flange or through a vacuum bellows, opening the vacuum chamber to maintain the ion source, and exposing the vacuum chamber to the atmospheric environment will cause a lot of air to adhere to the chamber. The water, oxygen and other gas molecules in the vacuum will require a long vacuuming process for the next use, which not only wastes time, but also may pollute the target used for sputtering and affect the experimental results.

[0003] In addition, due to the fear that the radio frequency ion source will affect the trajectory of the charged beam in the vacuum chamber, the radio frequency ion source is fixed outside the vacuum chamber, and the distance between it and the sputtering target cannot be adjusted, which will affect Adjustment of experimental parameters and flexibility of equipment use

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