Preparation method for high-CTI halogen-free type CEM-3 copper-clad plate

Abstract

The invention belongs to the technical field of copper-clad plate production and relates to a preparation method for a high-CTI halogen-free type CEM-3 copper-clad plate. According to the prepared copper-clad plate, halogen-free epoxy resin is used for being combined with aluminum hydroxide, so that the comparative tracking index (CTI) of the copper-clad plate is improved, nitrogenous phenolic resin is used for solidifying phosphorous-contained epoxy resin, in addition, an organophosphorous fire retardant is added, so that the nitrogen-phosphorous synergistic flame-retardant effect is achieved, and the UL certification FV0 grade is reached. The copper-clad plate prepared by the preparation method for the high-CTI halogen-free type CEM-3 copper-clad plate meets the halogen-free environmental requirement, the peeling strength of copper foil and a base material is improved, it is guaranteed that the copper-clad plate can be used in environments in high damp and hot, high pollution and high voltage conditions, the service life of the copper-clad plate is prolonged, and the production cost is reduced.

Description

technical field

[0001] The invention relates to a copper-clad laminate, in particular to a method for preparing a high-CTI, halogen-free CEM-3 copper-clad laminate, and belongs to the technical field of copper-clad laminate production. Background technique

[0002] Copper clad laminates are widely used in the manufacture of printed circuit boards (referred to as PCBs) for various household appliances, electronic information products and industrial electronic products. As the substrate material of printed circuit boards, it plays the three major functions of carrying electronic components, forming conductive circuit patterns, and insulating between layers and lines. It is an important electronic basic material.

[0003] The flame retardancy of CCL is one of the important safety performances of electronic products. Halogen-based flame-retardant materials (including Cl, Br) have been used in the printed circuit substrate industry for many years due to their economy and reliabi...