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Preparation method for high-CTI halogen-free type CEM-3 copper-clad plate

A CEM-3, halogen-free technology, used in the field of copper clad laminates, can solve the problems of low peel strength, low CTI, and high price, and achieve the effects of improving tracking resistance, improving peel strength, and reducing production costs.

Active Publication Date: 2015-10-28
SHANDONG JINBAO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The current halogen-free CEM-3 copper clad laminate uses dicyandiamide to cure pure phosphorus-containing epoxy system to make resin for glass cloth. Make production cost high

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] A preparation method of high CTI, halogen-free CEM-3 copper clad laminate, the steps are as follows:

[0025] (1) Preparation of resin emulsion for glass cloth: add 45 parts of halogen-free epoxy resin (epoxy equivalent to 400g / eq), 1 part of dicyandiamide, 32 parts of aluminum hydroxide and 22 parts of dimethylformamide to react Kettle, stirred at 20°C for 8 hours, then emulsified with a high-speed emulsifier for 2.5 hours, and finally placed in the reactor for aging for 12 hours;

[0026] (2) Preparation of resin emulsion for cellophane: 35 parts of phosphorus-containing epoxy resin (epoxy equivalent is 450g / eq), 10 parts of nitrogen-containing phenolic resin, 20 parts of aluminum hydroxide, 15 parts of talcum powder, 5 parts of triphenyl phosphate The ester and 15 parts of dimethylformamide were added to the reaction kettle in sequence, stirred at 20°C for 8 hours, then emulsified with a high-speed emulsifier for 2.5 hours, and finally placed in the reaction kettle f...

Embodiment 2

[0031] A preparation method of high CTI, halogen-free CEM-3 copper clad laminate, the steps are as follows:

[0032] (1) Preparation of resin emulsion for glass cloth: Add 55 parts of halogen-free epoxy resin (epoxy equivalent of 450g / eq), 2 parts of dicyandiamide, 28 parts of aluminum hydroxide and 15 parts of dimethylformamide to the reaction Kettle, stirred at 40°C for 5 hours, then emulsified with a high-speed emulsifier for 1.5 hours, and finally placed in the reactor for aging for 16 hours;

[0033] (2) Preparation of resin emulsion for glass mat: 42 parts of phosphorus-containing epoxy resin (epoxy equivalent is 350g / eq), 15 parts of nitrogen-containing phenolic resin, 15 parts of aluminum hydroxide, 10 parts of talcum powder, 8 parts of triphosphoric acid Cresyl ester and 10 parts of dimethylformamide were added to the reactor in turn, stirred at 40°C for 5 hours, then emulsified with a high-speed emulsifier for 1.5 hours, and finally placed in the reactor for aging fo...

Embodiment 3

[0038] A preparation method of high CTI, halogen-free CEM-3 copper clad laminate, the steps are as follows:

[0039] (1) Preparation of resin emulsion for glass cloth: Add 65 parts of halogen-free epoxy resin (epoxy equivalent to 400g / eq), 1 part of dicyandiamide, 24 parts of aluminum hydroxide and 10 parts of dimethylformamide to the reaction Kettle, stirred at 30°C for 6h, then emulsified with a high-speed emulsifier for 2.0h, and finally placed in the reactor for aging for 15h;

[0040] (2) Preparation of resin emulsion for cellophane: 50 parts of phosphorus-containing epoxy resin (epoxy equivalent is 350g / eq), 12 parts of nitrogen-containing phenolic resin, 13 parts of aluminum hydroxide, 5 parts of talcum powder, 5 parts of phosphoric acid tri( Add xylene) ester and 15 parts of dimethylformamide to the reactor in turn, stir at 30°C for 6h, then use a high-speed emulsifier to emulsify for 2.0h, and finally place it in the reactor for aging for 15h;

[0041] (3) Coat the g...

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Abstract

The invention belongs to the technical field of copper-clad plate production and relates to a preparation method for a high-CTI halogen-free type CEM-3 copper-clad plate. According to the prepared copper-clad plate, halogen-free epoxy resin is used for being combined with aluminum hydroxide, so that the comparative tracking index (CTI) of the copper-clad plate is improved, nitrogenous phenolic resin is used for solidifying phosphorous-contained epoxy resin, in addition, an organophosphorous fire retardant is added, so that the nitrogen-phosphorous synergistic flame-retardant effect is achieved, and the UL certification FV0 grade is reached. The copper-clad plate prepared by the preparation method for the high-CTI halogen-free type CEM-3 copper-clad plate meets the halogen-free environmental requirement, the peeling strength of copper foil and a base material is improved, it is guaranteed that the copper-clad plate can be used in environments in high damp and hot, high pollution and high voltage conditions, the service life of the copper-clad plate is prolonged, and the production cost is reduced.

Description

technical field [0001] The invention relates to a copper-clad laminate, in particular to a method for preparing a high-CTI, halogen-free CEM-3 copper-clad laminate, and belongs to the technical field of copper-clad laminate production. Background technique [0002] Copper clad laminates are widely used in the manufacture of printed circuit boards (referred to as PCBs) for various household appliances, electronic information products and industrial electronic products. As the substrate material of printed circuit boards, it plays the three major functions of carrying electronic components, forming conductive circuit patterns, and insulating between layers and lines. It is an important electronic basic material. [0003] The flame retardancy of CCL is one of the important safety performances of electronic products. Halogen-based flame-retardant materials (including Cl, Br) have been used in the printed circuit substrate industry for many years due to their economy and reliabi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B17/02B32B17/04B32B17/10B32B27/38B32B27/18B32B15/20B32B17/06B32B37/06B32B37/08B32B37/10B32B37/24B32B38/16
CPCB32B15/20B32B17/02B32B17/04B32B17/06B32B17/10B32B27/08B32B27/18B32B27/38B32B37/06B32B37/08B32B37/10B32B37/24B32B38/164B32B2037/243B32B2262/101
Inventor 陈长浩李宝东陈晓鹏赵东郑宝林谢锋朱义刚姜晓亮王好兵
Owner SHANDONG JINBAO ELECTRONICS