Preparation method for composite group CEM-3 copper-clad laminate (CCL) with high comparative tracking index (CTI) and high thermal conductivity
A technology with high thermal conductivity and composite matrix, which is applied in chemical instruments and methods, paper/cardboard layered products, electronic equipment, etc., can solve the problems of low CTI, poor heat resistance and heat dissipation, and poor machinability of aluminum substrates. The effect of prolonging service life, improving thermal conductivity and reducing dosage
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Embodiment 1
[0020] A kind of preparation method of high CTI, high thermal conductivity composite matrix CEM-3 copper-clad laminate, the steps are as follows:
[0021] (1) Preparation of resin emulsion for glass cloth: 45 parts of bromine-free epoxy resin (epoxy equivalent of 400g / eq), 1 part of dicyandiamide, 25 parts of aluminum hydroxide, 8 parts of inorganic filler and 21 parts of dimethyl Formamide was added to the reaction kettle in turn, stirred at 20°C for 8 hours, then emulsified with a high-speed emulsifier for 1.5 hours, and finally placed in the reaction kettle for 12 hours of aging;
[0022] (2) Preparation of resin emulsion for cellophane: 45 parts of low-bromine epoxy resin (epoxy equivalent is 400g / eq), 0.5 parts of dicyandiamide, 20 parts of alumina, 15 parts of inorganic filler, 4.5 parts of silicon carbide and 15 parts Dimethylformamide was added to the reactor in turn, stirred at 20°C for 8 hours, then emulsified with a high-speed emulsifier for 1.5 hours, and finally p...
Embodiment 2
[0027] A kind of preparation method of high CTI, high thermal conductivity composite matrix CEM-3 copper-clad laminate, the steps are as follows:
[0028] (1) Preparation of resin emulsion for glass cloth: 55 parts of bromine-free epoxy resin (epoxy equivalent of 450g / eq), 2 parts of dicyandiamide, 22 parts of aluminum hydroxide, 5 parts of inorganic filler and 16 parts of dimethyl Formamide was added to the reaction kettle in turn, stirred at 40°C for 5 hours, then emulsified with a high-speed emulsifier for 2.5 hours, and finally placed in the reaction kettle for 16 hours of aging;
[0029] (2) Preparation of resin emulsion for glass mat: 50 parts of low bromine epoxy resin (epoxy equivalent is 450g / eq), 1 part of dicyandiamide, 14 parts of alumina, 10 parts of inorganic filler, 8 parts of silicon carbide and 17 parts Parts of dimethylformamide were added to the reactor one by one, stirred at 40°C for 5 hours, then emulsified by a high-speed emulsifier for 2.5 hours, and fin...
Embodiment 3
[0034] A kind of preparation method of high CTI, high thermal conductivity composite matrix CEM-3 copper-clad laminate, the steps are as follows:
[0035] (1) Preparation of resin emulsion for glass cloth: mix 65 parts of bromine-free epoxy resin (epoxy equivalent of 400g / eq), 1 part of dicyandiamide, 20 parts of aluminum hydroxide, 4 parts of inorganic filler and 10 parts of dimethyl Formamide was added to the reaction kettle in turn, stirred at 30°C for 6 hours, then emulsified by a high-speed emulsifier for 2.0 hours, and finally placed in the reaction kettle for 14 hours of aging;
[0036] (2) Preparation of resin emulsion for cellophane: 55 parts of low-bromine epoxy resin (epoxy equivalent is 450g / eq), 0.5 parts of dicyandiamide, 8 parts of alumina, 5 parts of inorganic fillers, 10 parts of silicon carbide and 21.5 parts Dimethylformamide was added to the reactor in turn, stirred at 30°C for 6 hours, then emulsified with a high-speed emulsifier for 2.0 hours, and finally...
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