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A kind of preparation method of high cti, halogen-free type cem-1 copper clad laminate

A CEM-1, halogen-free technology, applied in the field of copper clad laminates, can solve the problems of low peel strength, low CTI, and increased production costs, and achieve the effects of reducing production costs, prolonging service life, and improving peel strength

Active Publication Date: 2017-01-11
SHANDONG JINBAO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The current halogen-free CEM-1 copper clad laminate uses dicyandiamide to cure pure phosphorus-containing epoxy system to make resin for glass cloth, which has low CTI, low peel strength and high cost; or uses nitrogen-containing phenolic resin to cure phosphorus-containing ring Oxygen resin system, adding inorganic fillers to make resin for bleached wood pulp paper, due to the high price of phosphorus-containing epoxy resin, thus increasing the production cost

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] A preparation method of high CTI, halogen-free CEM-1 copper clad laminate, the steps are as follows:

[0023] (1) Preparation of resin emulsion for glass cloth: 45 parts of bisphenol A type epoxy resin (epoxy equivalent is 400g / eq), 1 part of dicyandiamide, 33 parts of aluminum hydroxide and 21 parts of dimethylformamide Add to the reaction kettle and stir evenly at 25°C;

[0024] (2) Preparation of resin emulsion for bleached wood pulp paper: 35 parts of bisphenol A type epoxy resin (epoxy equivalent is 180g / eq), 10 parts of nitrogen-containing phenolic resin, 10 parts of aluminum hydroxide, 15 parts of melamine cyanurate , 5 parts of melamine polyphosphate, 10 parts of triphenyl phosphate and 15 parts of acetone were added to the reaction kettle in sequence, and stirred evenly at 15°C;

[0025] (3) Coat the glass cloth prepared in step (1) with a resin emulsion on both sides of the electronic grade glass cloth, dry it at 160°C for 1 min, control the glue content to 5...

Embodiment 2

[0029] A preparation method of high CTI, halogen-free CEM-1 copper clad laminate, the steps are as follows:

[0030] (1) Preparation of resin emulsion for glass cloth: 55 parts of bisphenol A type epoxy resin (epoxy equivalent is 450g / eq), 2 parts of dicyandiamide, 28 parts of aluminum hydroxide and 15 parts of dimethylformamide Add to the reaction kettle and stir evenly at 45°C;

[0031] (2) Preparation of resin emulsion for bleached wood pulp paper: 42 parts of bisphenol A type epoxy resin (epoxy equivalent is 210g / eq), 15 parts of nitrogen-containing phenolic resin, 8 parts of aluminum hydroxide, 10 parts of melamine cyanurate , 7 parts of melamine polyphosphate, 8 parts of propylbenzene-based phosphate and 10 parts of acetone were added to the reactor in sequence, and stirred evenly at 40°C;

[0032] (3) Coat the glass cloth prepared in step (1) with a resin emulsion on both sides of the electronic grade glass cloth, dry it at 160°C for 1 min, control the glue content to ...

Embodiment 3

[0036] A preparation method of high CTI, halogen-free CEM-1 copper clad laminate, the steps are as follows:

[0037] (1) Preparation of resin emulsion for glass cloth: 65 parts of bisphenol A type epoxy resin (epoxy equivalent is 420g / eq), 1 part of dicyandiamide, 24 parts of aluminum hydroxide and 10 parts of dimethylformamide Add to the reaction kettle and stir evenly at 30°C;

[0038] (2) Preparation of resin emulsion for bleached wood pulp paper: 50 parts of bisphenol A type epoxy resin (epoxy equivalent is 200g / eq), 12 parts of nitrogen-containing phenolic resin, 5 parts of aluminum hydroxide, 8 parts of melamine cyanurate , 10 parts of melamine polyphosphate, 5 parts of tris(xylene) phosphate and 10 parts of acetone were added to the reaction kettle in turn, and stirred evenly at 30°C;

[0039] (3) Coat the glass cloth prepared in step (1) with a resin emulsion on both sides of the electronic grade glass cloth, dry it at 160°C for 1 min, control the glue content to 50±1...

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PUM

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Abstract

The invention belongs to the technical field of copper-clad plate production and relates to a preparation method of a copper-clad plate high in CTI and halogen-free type CEM-1. The preparation method comprises the steps of utilizing halogen-free epoxy resin for combining with aluminium hydroxide, so that the comparative tracking index (CTI) of the copper-clad plate is improved, utilizing nitrogen-containing phenolic aldehyde for solidifying the halogen-free epoxy resin, and then adding organic nitrogen and phosphor inflaming retarding filler, so that the nitrogen and phosphor work together in inflaming retardation for achieving the FV0 grade of UL authentication. According to the copper-clad plate obtained through the preparation method, halogen-free environment-friendly requirements are satisfied, peeling strength of copper foil and substrates is improved, it is guaranteed that the plate can be applied in an environment high in dampness, temperature, pollution degree, voltage and the like, the service life of the plate is prolonged, and the production cost is reduced.

Description

technical field [0001] The invention relates to a copper-clad laminate, in particular to a method for preparing a high-CTI, halogen-free CEM-1 copper-clad laminate, and belongs to the technical field of copper-clad laminate production. Background technique [0002] Copper clad laminates are widely used in the manufacture of printed circuit boards (referred to as PCBs) for various household appliances, electronic information products and industrial electronic products. As the substrate material of printed circuit boards, it plays the three major functions of carrying electronic components, forming conductive circuit patterns, and insulating between layers and lines. It is an important electronic basic material. [0003] The flame retardancy of CCL is one of the important safety performances of electronic products. Halogen-based flame-retardant materials (including Cl, Br) have been used in the printed circuit substrate industry for many years due to their economy and reliabi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B17/02B32B17/10B32B27/04B32B27/38B32B27/18B32B27/10B32B17/06B32B15/20B32B37/02B32B37/14B32B38/16
CPCB32B15/20B32B17/02B32B17/065B32B17/10027B32B27/10B32B27/18B32B27/38B32B37/02B32B37/14B32B38/164B32B2260/046B32B2262/101
Inventor 李宝东陈长浩陈晓鹏郑宝林赵东谢锋刘文江姜晓亮朱义刚
Owner SHANDONG JINBAO ELECTRONICS