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UV laser drilling method and printed circuit board with blind hole

A printed circuit board and laser drilling technology, which is applied in the direction of printed circuit, printed circuit manufacturing, and electrical connection formation of printed components, etc., can solve the problem of wiring obstacles in the inner layer of multilayer printed circuit boards, damage the impedance characteristics of the power ground layer, Unable to meet the problems of printed circuit boards, etc., to achieve the effect of simple and fast design work, increase the space for wiring, and reduce the size and number of layers

Active Publication Date: 2015-11-04
SUZHOU VEGA TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the design and processing of traditional printed circuit boards, the through holes cannot meet the development direction of printed circuit boards: firstly, the through holes occupy a large amount of effective space, and secondly, a large number of through holes are densely packed, which is also harmful to the multilayer printed circuit board. These through holes take up the space required for routing, and the through holes pass through the surface of the power and ground layers densely, and also destroy the impedance characteristics of the power ground layer, making the power ground layer invalid

Method used

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  • UV laser drilling method and printed circuit board with blind hole
  • UV laser drilling method and printed circuit board with blind hole
  • UV laser drilling method and printed circuit board with blind hole

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Embodiment 1

[0044] The UV laser drilling method provided in this embodiment is suitable for printed circuit boards, that is, blind holes are formed on the printed circuit board by the method; the printed circuit board includes a bottom copper layer and is located on the At least one module unit is laminated on the upper surface of the bottom copper layer, the module unit includes a copper layer and a dielectric layer from top to bottom, and the method is repeatedly used to drill through N module units from top to bottom, corresponding to Forming N-order blind holes of the printed circuit board, the N≥1; the method includes:

[0045] Step 100, determining a drilling position corresponding to the blind hole on the upper surface of the copper layer;

[0046] Step 200, drilling: implementing high-energy UV laser drilling at the drilling position, and drilling a first drilling hole by using a helical or concentric scanning method, and the first drilling hole penetrates the copper layer and ext...

Embodiment 2

[0061] In order to better implement the UV laser drilling method of Embodiment 1 of the present invention, the present invention also provides a printed circuit board with blind holes for realizing the present invention. Hole printed circuit board implementations are described in further detail.

[0062] see Figure 4 , Figure 5 As shown, the present embodiment provides a printed circuit board with blind holes; Figure 4 It is a schematic structural diagram of a printed circuit board according to an embodiment of the present invention, in which a first-order blind hole and a module unit are shown in the figure; Figure 5 It is a schematic structural diagram of a printed circuit board according to an embodiment of the present invention, in which a plurality of blind holes and seven module units are shown in the figure; Figure 4 , 5 The hatching shown is not to express the hatching, but to show the copper layer and the bottom copper layer more clearly.

[0063] see Figu...

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Abstract

The invention relates to the technical field of printed circuit boards and specifically relates to a UV laser drilling method and a printed circuit board with a blind hole. The UV laser drilling method is applied to the printed circuit board. The method comprises the steps as follows: determining a drilling position corresponding to the blind hole; performing drilling: performing high-energy UV laser drilling at the drilling position to drill a first drill hole; performing second drilling: performing defocus UV laser drilling at the drilling position to drill a second drill hole; and performing third drilling: performing UV laser drilling at the drilling position to drill a third drill hole. The printed circuit board uses the UV laser drilling method to prepare the blind hole. The object of the invention is to form the blind hole in the printed circuit board so as to increase wiring space of the printed circuit board and improve the precision, density and reliability of the printed circuit board.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a UV laser drilling method, and to a printed circuit board with blind holes. Background technique [0002] Printed circuit board, also known as printed circuit board, PCB (Printed Circuit Board), is an important electronic component, a support for electronic components, and a carrier for electrical connections of electronic components. In the past ten years, my country's printed circuit board manufacturing industry has developed rapidly, and its total output value and total output both rank first in the world. Due to the ever-changing electronic products, the price war has changed the structure of the supply chain. China has both industrial distribution, cost and market advantages, and has become the most important production base of printed circuit boards in the world. [0003] With the development of electronic products towards high density and high precision, c...

Claims

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Application Information

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IPC IPC(8): H05K3/40B23K26/382
CPCH05K3/0047H05K3/40H05K2203/107
Inventor 张瑞刘艳冬
Owner SUZHOU VEGA TECH CO LTD