Intelligent power module and manufacturing method thereof

Abstract

The present invention is applicable to the manufacturing technology of electronic devices, and provides an intelligent power module and a manufacturing method. The intelligent power module includes: a substrate, including a first surface and a second surface opposite to the first surface, and the first surface forms wrinkles pleats, the second surface is covered with an insulating layer, the substrate is a paper radiator; a circuit wiring layer is formed on the surface of the insulating layer; circuit elements are arranged at corresponding positions of the circuit wiring layer; metal wires , connecting the circuit wiring layer and circuit elements. Since the back of the intelligent power module has heat dissipation wrinkles, the heat dissipation area is greatly increased, and the insulating layer can meet the heat dissipation requirements of the power components without using high thermal conductivity materials; the heat dissipation structure is made of paper material, which is light in weight, and the overall weight of the intelligent power module is reduced, which is convenient Long-distance transportation and assembly by workers; because the module itself has a radiator, there is no need to connect an external radiator during the application process, which reduces application difficulty and cost and improves assembly quality.

Description

technical field [0001] The invention belongs to the field of electronic device manufacturing technology, and in particular relates to an intelligent power module and a manufacturing method thereof. Background technique [0002] Intelligent Power Module (IPM) is a power drive product that combines power electronics and integrated circuit technology. IPM integrates power switching devices and high-voltage drive circuits, and has built-in fault detection circuits such as overvoltage, overcurrent and overheating. On the one hand, the IPM receives the control signal from the MCU to drive the subsequent circuits to work, and on the other hand, sends the system status detection signal back to the MCU. Compared with the traditional discrete solution, IPM wins more and more markets with its advantages of high integration and high reliability. It is especially suitable for frequency converters and various inverter power supplies for driving motors. An ideal power electronic device f...

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Problems solved by technology

[0003] Because the smart power module generally works in a high-temperature environment, and the power device in the smart power module will emit a lot of heat when it is working, resulting in a high junction temperature of the power device. Although the circuit substrate has a heat dissipation effect, because the insulating layer The presence of , resulting in a higher overall thermal resistance of the intelligent power module

[0004] The long-term operation of the intelligent power module at high temperature will seriously reduce the service life and affect the stability of performance. In extreme cases, it will cause the intelligent power module to explode out of control due to the overheating of the internal components during the working process, causing casualties and property loss

[0005] Selecting a high thermal conductivity insulating layer and adding a heat sink is the main method to solve the heat dissipation problem of the current intelligent power module; however, the cost of the high thermal conductivity insulating layer is very high on the one hand, and on the other hand, the hardness of the high thermal conductivity insulating layer is very high due to the use of a large amount of impurities. This increases the manufacturing difficulty of the smart power module; if the heat sink is placed inside the smart power module, the power components are mounted on the heat sink, on the one hand, it will increase the cost of raw materials, and on the other hand, the process difficulty of the smart power module will be increased; if Adding a radiator outside the intelligent power module, and mounting the radiator on the back of the intelligent power module, on the one hand increases the application cost, and on the other hand increases the difficulty of assembly, which creates difficulties for the application and promotion of the intelligent power module, which is not conducive to the intelligent power module Popularity in civilian occasions

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