Semiconductor laser synchronous welding set and operating mode thereof

A welding device and semiconductor technology, applied in laser welding equipment, auxiliary equipment, welding equipment, etc., can solve the problems of foreign objects, unsightly welding seams, high cost, etc., and achieve small mechanical stress, fast welding speed, and small thermal stress Effect

Inactive Publication Date: 2015-12-02
SHANGHAI SEEYAO ELECTRONICS CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Aiming at the above-mentioned problems existing in the existing laser welding, a semiconductor laser synchronous welding device aiming at realizing synchronous welding and having fast, stable and firm w

Method used

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  • Semiconductor laser synchronous welding set and operating mode thereof
  • Semiconductor laser synchronous welding set and operating mode thereof
  • Semiconductor laser synchronous welding set and operating mode thereof

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Embodiment Construction

[0026] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention.

[0027] figure 1 It is a schematic diagram of a semiconductor laser synchronous welding device, please refer to figure 1 shown. A semiconductor laser synchronous welding device of a preferred embodiment is shown, which includes an upper mold clamp 1 and a lower mold clamp 2, and the lower mold clamp 2 can be matched with the upper mold clamp 1, that is, the lower mold clamp 2 can be moved The upper mold clamp 1 is connected closely, or the upper mold clamp 1 can be connected with the lower mold clamp 2 by moving. Of course, it also includes an organic base, which is used for fixedly installing the upper mold fixture 1 and the lower mold fixture 2, and the machine base will be described in detail below.

[0028] In addition, the lower mold fixture 2 is provided with a positioning device, and th...

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Abstract

The invention discloses a semiconductor laser synchronous welding set and an operating mode thereof. The semiconductor laser synchronous welding set comprises an upper die fixture and a lower die fixture. The lower die fixture is provided with a positioning device. The upper die fixture has a plurality of fiber output ends which right face a welding area of a device to be welded. The operating mode includes: placing the device to be welded in the lower die fixture and securing the device through the positioning device; allowing a lifting device to drive the lower die fixture to get close and connect to the upper die fixture; reflecting laser by an inner chamber to form compressed continuous spots, and irradiating the welding area of the device to be detected with the spots so as to melt the surface of the device. During using of the semiconductor laser synchronous welding set and the operating mode thereof, laser synchronous welding is used, welding speed is high, a seam in the welding area has constant width, single-step forming is achieved, welding quality and firming capacity are effectively improved, and no any additional fluxes are required.

Description

technical field [0001] The invention relates to the technical field of processing equipment, in particular to a semiconductor laser synchronous welding device. Background technique [0002] Welding is a manufacturing process and technology that uses heat, high temperature or high pressure to join metal or other thermoplastic materials such as plastics. Existing welding methods adopt hot plate welding, ultrasonic welding and laser welding, but the welding speed, firmness and welding appearance of hot plate welding and ultrasonic welding are far inferior to laser welding. Laser welding is asynchronous welding, only one laser beam is welded along the welding area. This method cannot achieve one-time welding. For example, for car lamp welding, stress will be generated in different directions during the welding process, and the consistency of welding cannot be guaranteed. , Welding speed is relatively low. Contents of the invention [0003] Aiming at the above-mentioned probl...

Claims

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Application Information

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IPC IPC(8): B29C65/16B23K26/21B23K26/70B23K37/04
CPCB29C65/1667B29C65/1616B29C65/1635B29C65/1687B29C66/301B29C66/542B29C66/73921B29C66/8242B29C66/8322B29L2031/30B29L2031/747
Inventor 杨晓锋陆维栋黄海王永和朱彦
Owner SHANGHAI SEEYAO ELECTRONICS CO LTD
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