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High temperature creep-resistant flake alumina porous ceramic used for LED lamp heat dissipation, and preparation method thereof

A technology of flake alumina and LED lamps, which is applied in the field of porous heat dissipation ceramics, can solve the problems of uneven dispersion of alumina, uneven ceramic structure, poor compatibility, etc., to reduce cracking failure problems, good transition, and improve thermal conductivity sexual effect

Inactive Publication Date: 2015-12-02
合肥凯士新材料贸易有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method cannot disperse the alumina uniformly, it is easy to agglomerate, and the ceramic structure is not uniform, and if the ceramic sheet is applied to the LED heat sink, it is necessary to improve the toughness, thermal conductivity, crack resistance, and heat resistance of the ceramic.
The compatibility between the ceramic sheet and metal is relatively poor and needs to be improved

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0015] A high-temperature creep-resistant sheet-shaped alumina porous ceramic for heat dissipation of LED lamps, made of the following raw materials in parts by weight (kg): α-Al 2 o 3 (particle size 2-8μm) 35, deionized water 103, sodium polyacrylate 0.3, methyl cellulose 2.1, glycerol 1.7, yttrium aluminum garnet fiber 1.5, nano tin dioxide 0.7, tantalum nitride 0.4, silicon Calcium barium alloy powder 1.6, nano aluminum hydroxide 4.5, nano copper 1.3, PVA binder 1.

[0016] The production method of the described heat-resistant and creep-resistant sheet-shaped alumina porous ceramics for heat dissipation of LED lamps is characterized in that:

[0017] (1) Add α-Al 2 o 3 , yttrium aluminum garnet fiber, silicon-calcium-barium alloy powder, deionized water, and sodium polyacrylate are mixed to obtain a suspension, and the suspension is ball milled for 5 hours, adding nano-tin dioxide and tantalum nitride, mixing evenly, and then adding PVA to bond agent, mix evenly, then a...

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Abstract

The invention discloses a high temperature creep-resistant flake alumina porous ceramic used for LED lamp heat dissipation. The flake alumina porous ceramic is prepared from, by weight, 34 to 36 parts of alpha-Al2O3 (particle size ranging from 2 to 8<mu>m), 100 to 105 parts of deionized water, 0.2 to 0.3 part of sodium polyacrylate, 2 to 2.3 parts of methylcellulose, 1.6 to 1.8 parts of glycerin, 1.3 to 1.8 parts of yttrium aluminum garnet fiber, 0.6 to 0.8 part of nanometer tin dioxide, 0.3 to 0.5 part of tantalum nitride, 1.5 to 1.8 parts of silicon-calcium-barium alloy powder, 4 to 5 parts of nano-aluminium hydroxide, 1.2 to 1.5 parts of nano-copper, and 0.9 to 1.1 parts of PVA binder. According to the preparation method, yttrium aluminum garnet fiber, nanometer tin dioxide, and tantalum nitride are added, so that oxidation resistance, high temperature resistance, high temperature creep resistance, and thermal conductivity of ceramic are improved; silicon-calcium-barium alloy powder is added, so that recombination property with metal is improved, and thermal conductivity is increased.

Description

technical field [0001] The invention relates to the field of porous heat dissipation ceramics, in particular to a high-temperature creep-resistant sheet-shaped alumina porous ceramic for heat dissipation of LED lamps and a preparation method thereof. Background technique [0002] Light-emitting diode (LED) is a type of light-emitting device that can directly convert electrical energy into visible light and radiant energy. It has strong market potential, and high-power LEDs are considered by the industry to be the main direction of the lighting source market1. At the current level, high-power LEDs can only convert 10% to 20% of the input power into light energy, and the remaining 80% to 90% are converted into heat energy. In order to ensure its normal operation, it is necessary to ensure that the operating temperature of the LED is within the allowable range through an effective heat dissipation design. Therefore, the heat dissipation problem of high-power LED chips has beco...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/10C04B35/80C04B38/06
Inventor 董照海
Owner 合肥凯士新材料贸易有限公司
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