Method for preparing high-performance TFT
A high-performance, metal-layer technology, used in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as time-consuming and achieve low cost and improve efficiency.
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[0038] In order to make the objectives, technical solutions, and advantages of the present invention clearer, the various embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, a person of ordinary skill in the art can understand that, in each embodiment of the present invention, many technical details are proposed for the reader to better understand the present application. However, even without these technical details and various changes and modifications based on the following embodiments, the technical solutions claimed by the claims of this application can be realized.
[0039] The first embodiment of the present invention relates to a method of manufacturing a high-performance TFT. The specific flowchart is as figure 1 As shown, in this embodiment, the method for preparing a high-performance TFT includes the steps:
[0040] S100: Provide a substrate, and sequentially form an active layer, a dielectric laye...
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