Lead-free solder alloy
A solder and alloy technology, applied in metal processing equipment, welding/cutting media/materials, welding media, etc., can solve the problems of reduced mechanical strength of brazed joints, achieve improved connection reliability, inhibit growth, and achieve high tensile strength The effect of elongation
Inactive Publication Date: 2015-12-02
SENJU METAL IND CO LTD
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Problems solved by technology
Furthermore, the amount of solder alloy used for soldering is reduced, so the mechanical strength of the soldered joint is reduced
Method used
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[0056] The solder alloy shown in Table 1 was produced. Using this solder alloy, determine the melting point, tensile strength, and elongation (ductility) of the solder alloy, and use the solder joint formed with the solder alloy to determine the P enrichment as shown below Measurement of layer thickness, shear strength and plate exposure rate. The results are shown in Table 1.
[0057] (Melting point of solder alloy)
[0058] Regarding the melting point, a DSC (differential scanning calorimetry; Differential scanning calorimetry) (manufactured by Seiko Instruments Inc.: DSC6200) was used to measure the melting point (°C) at a temperature increase rate of 5°C / min.
[0059] (Tensile strength, elongation (ductility))
[0060] Using a tensile strength testing machine (manufactured by Shimadzu Corporation, AUTOGRAPHAG-20kN), the stroke speed was set to 6.0 mm / min, the strain rate was set to 0.33% / sec, and the solders shown in Table 1 The alloy is formed into a predetermined shape, and t...
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Abstract
Provided is an Sn-Bi-Cu-Ni lead-free solder alloy which has a low melting point, excellent ductility and high tensile strength, while having a high shear strength by suppressing the generation of a P-rich layer at the bonding interface and thus suppressing strain of a substrate, thereby achieving excellent connection reliability. In order to suppress diffusion of Cu and Ni from an electrode and to ensure elongation and wettability of the solder alloy, this lead-free solder alloy has an alloy composition that is composed, in mass%, of 31-59% of Bi, 0.3-1.0% of Cu and 0.01-0.06% of Ni with the remainder made up of Sn.
Description
Technical field [0001] The present invention relates to a lead-free solder alloy. In particular, it relates to a Sn-Bi-Cu-Ni lead-free solder alloy with excellent connection reliability. Background technique [0002] In recent years, electronic devices such as mobile phones have tended to be smaller and thinner. In electronic components such as semiconductor devices used in such electronic devices, substrates with a thickness of a few mm to 1 mm or less have begun to be used. [0003] On the other hand, Sn-Ag-Cu solder alloys have been widely used as lead-free solders. The melting point of Sn-Ag-Cu solder alloy is relatively high, and even the Sn-3Ag-0.5Cu solder alloy, which belongs to the eutectic composition, exhibits around 220°C. Therefore, when soldering electrodes of a thin substrate as described above using a Sn-Ag-Cu solder alloy, the substrate is strained due to the heat during bonding, which may cause bonding failure. [0004] In response to this connection failure, th...
Claims
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IPC IPC(8): C22C13/02B23K1/00B23K1/19B23K35/26C22C12/00H01L21/60H05K3/34
CPCB23K1/00B23K1/0016B23K1/19B23K35/26B23K35/262B23K35/264C22C12/00C22C13/02H01L24/11H01L24/13H01L24/16H01L2224/1132H01L2224/11334H01L2224/1134H01L2224/13111H01L2224/13113H01L2224/16225H01L2224/16227H01L2224/81444H01L2224/81447H01L2224/81455H01L2924/01322H05K3/3463H01L2924/01083H01L2924/01029H01L2924/01028H01L2924/0105H01L2924/01015H01L2924/01032H01L2924/00014H01L2924/00H01L2224/13147H01L2224/13155H01L2924/01103H01L2924/01108H01L2924/01109H01L2924/0134H01L2924/014H01L2924/14H01L2924/15701
Inventor 立花贤野村光
Owner SENJU METAL IND CO LTD