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Cutting method for multi-silicon-wafer mobile phone window

A cutting method and technology of silicon wafers, which are applied in the direction of fine working devices, stone processing equipment, manufacturing tools, etc., can solve problems such as difficult to improve, scrapped wafers, difficult work, etc.

Inactive Publication Date: 2015-12-09
CHANGZHOU C PE PHOTO ELECTRICITY SCI & TECHN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The earliest multi-wire cutting equipment is mainly composed of steel wire and mortar. During the cutting process, the mortar is sprayed between the steel wire and the processed crystal. Now this kind of multi-wire cutting equipment is mainly used in the cutting process of monocrystalline silicon and polycrystalline silicon wafers. However, in the cutting process, if the warpage of the wafer is large, it will be difficult to improve it in the subsequent processing process, which will not only cause certain difficulties in the subsequent work, but also cause the wafer to be scrapped.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0014] specific implementation plan

[0015] A kind of multi-silicon wafer mobile phone window cutting method is:

[0016] (1) Clean the multi-silicon wafer mobile phone window for 30 minutes in ultrasonic waves, and then dry it;

[0017] (2) Then use paraffin to stick the polysilicon chip mobile phone window on the stainless steel base, install the base on the friction sub-disc under the testing machine, and adjust the distance between the polysilicon chip mobile phone window and the thrust ring to 2-4mm;

[0018] (3) Then add the stirred wire cutting wire into it, load it and start the operation.

[0019] The wire-cutting fluid is composed of 1.78g polyethylene glycol, 1.3g diethanolamine, 10-15ppm sodium dodecylbenzenesulfonate, 0.56g organosiloxane, 1.2g sodium metaphosphate, 15g of grinding wheel abrasive grains were added to 100mL of deionized water, and then left to stand for 20-40min.

[0020] The anti-retraction ring rotates relative to the lens driven by the main ...

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PUM

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Abstract

The invention relates to a cutting method for a multi-silicon-wafer mobile phone window. The multi-silicon-wafer mobile phone window is washed for 30 min in ultrasonic waves and then dried; the multi-silicon-wafer mobile phone window is bonded to a stainless steel base through paraffin wax, the base is installed on a lower auxiliary friction plate of a tester, and the distance between the multi-silicon-wafer mobile phone window and a thrust ring is adjusted to be 2 mm to 4 mm; and then evenly-stirred linear cutting liquid is added to the window, and the window is loaded and started for operation.

Description

technical field [0001] The invention specifically relates to a method for cutting a multi-silicon wafer mobile phone window. Background technique [0002] The earliest multi-wire cutting equipment is mainly composed of steel wire and mortar. During the cutting process, the mortar is sprayed between the steel wire and the processed crystal. Now this kind of multi-wire cutting equipment is mainly used in the cutting process of monocrystalline silicon and polycrystalline silicon wafers. However, in the cutting process, if the warpage of the wafer is large, it will be difficult to improve it in the subsequent processing process, which will not only cause certain difficulties in the subsequent work, but also cause the wafer to be scrapped. [0003] Therefore, it is necessary to establish a corresponding relationship between the degree of warpage and the influencing factors. With this relationship, by observing the distribution of the degree of warpage, the factors affecting the d...

Claims

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Application Information

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IPC IPC(8): B28D5/04
Inventor 雷春生潘相成
Owner CHANGZHOU C PE PHOTO ELECTRICITY SCI & TECHN