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A high-voltage multi-heterojunction device with a normally-off channel

A multi-heterojunction and heterojunction technology, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of complex growth and difficult control.

Inactive Publication Date: 2017-12-01
SOUTHWEST JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the complex growth of III-V growth materials, it is difficult to achieve control by making grooves, bumps and steps from the substrate, and then growing non-planar single heterojunction channels by epitaxy

Method used

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  • A high-voltage multi-heterojunction device with a normally-off channel
  • A high-voltage multi-heterojunction device with a normally-off channel
  • A high-voltage multi-heterojunction device with a normally-off channel

Examples

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Embodiment 1

[0034] A high-voltage heterojunction device with a normally-off channel in this example, such as figure 2 As shown, it includes a first semiconductor substrate layer 201, a second semiconductor buffer layer 202, a third semiconductor layer 203, a fourth semiconductor layer 204, a fifth semiconductor layer 205, and a sixth semiconductor layer 206 arranged sequentially from bottom to top; The two ends of the fourth semiconductor layer 204 are respectively provided with a first ohmic contact 101 and a second ohmic contact 103; the sixth semiconductor layer 206 has a metal electrode 102, and the metal electrode 102 is between the first ohmic contact 101 and the second ohmic contact. Between the ohmic contacts 103; the junction of the third semiconductor layer 203 and the fourth semiconductor layer 204 forms a first heterojunction, and the junction of the fourth semiconductor layer 204 and the fifth semiconductor layer 205 forms a second heterojunction junction, the junction of th...

Embodiment 2

[0038] A high-voltage multi-heterojunction device with a normally-off channel in this example, such as image 3 As shown, it includes a first semiconductor substrate layer 201, a second semiconductor buffer layer 202, a third semiconductor layer 203, a fourth semiconductor layer 204, a fifth semiconductor layer 205, a sixth semiconductor layer 206, a Seven semiconductor layers 207; both ends of the fourth semiconductor layer 204 are respectively provided with a first ohmic contact 101 and a second ohmic contact 103; the seventh semiconductor layer 207 has a metal electrode 102, and the metal electrode 102 is on the first Between the ohmic contact 101 and the second ohmic contact 103; the junction of the third semiconductor layer 203 and the fourth semiconductor layer 204 forms a first heterojunction, and the junction of the fourth semiconductor layer 204 and the fifth semiconductor layer 205 A second heterojunction is formed at the junction of the fifth semiconductor layer 205...

Embodiment 3

[0042] A high-voltage multi-heterojunction device with a normally-off channel in this example, such as Figure 4As shown, it includes a first semiconductor substrate layer 201, a second semiconductor buffer layer 202, a third semiconductor layer 203, a fourth semiconductor layer 204, and a fifth semiconductor layer 205 arranged sequentially from bottom to top; the third semiconductor layer 203 The first ohmic contact 101 and the second ohmic contact 103 are respectively provided at both ends of the two ends; the fifth semiconductor layer 205 has a metal electrode 102, and the metal electrode 102 is between the first ohmic contact 101 and the second ohmic contact 103; The junction of the third semiconductor layer 203 and the fourth semiconductor layer 204 forms a first heterojunction, the junction of the fourth semiconductor layer 204 and the fifth semiconductor layer 205 forms a second heterojunction, and the fourth semiconductor layer The self-polarization electric field of t...

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PUM

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Abstract

The present invention relates to a heterojunction device with a new enhancement mechanism of power electronics technology, and in particular to a high-voltage multi-heterojunction device with a normally-off channel. The multi-heterojunction normally-off channel device of the present invention mainly uses the The third semiconductor layer, the fourth semiconductor layer, the fifth semiconductor layer, and the sixth semiconductor layer form a multi-heterojunction, with a non-planar structure under the gate, and the polarization direction of the non-planar heterojunction channel is the same as that of the third semiconductor layer. , The material growth directions of the fourth semiconductor layer, the fifth semiconductor layer and the sixth semiconductor layer have a certain angle to realize the discontinuity of the two-dimensional electron gas (2DEG) at the heterojunction interface, that is, a very closed electric current is formed between the source and the drain. connection, and finally realize the multi-heterojunction normally-off channel device. The beneficial effect of the invention is that the multi-heterojunction normally-off channel device can work stably in a high-temperature and high-field environment, the layout and process are easy to realize, and the threshold voltage of the normally-off channel is easy to control.

Description

technical field [0001] The invention relates to semiconductor technology, in particular to the realization principle and preparation technology of multi-heterojunction normally-off channels. Background technique [0002] The III-V semiconductor materials in the third-generation semiconductors have the characteristics of large band gap, high electron saturation velocity, high breakdown electric field, strong thermal conductivity and corrosion resistance, such as GaN, AlN, etc. In terms of electronic devices, III-V Group V materials are more suitable than silicon for making semiconductor devices with high temperature resistance, high frequency, high field and high power. [0003] When preparing electronic devices with III-V heterojunction structures, due to the strong two-dimensional electron gas in the III-V heterojunction structures, such as AlGaN / GaN heterojunction high electron mobility transistors (HEMTs) , most of them are depletion-type devices, and it is not easy to r...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L29/778H01L29/06H01L29/66
CPCH01L29/0688H01L29/66462H01L29/7783
Inventor 汪志刚陈协助孙江
Owner SOUTHWEST JIAOTONG UNIV