Low thermal-conductivity high temperature glue and preparation method thereof
A high-temperature glue, low thermal conductivity technology, applied in the field of refractory materials, can solve the problems of narrow application range, high thermal conductivity, unfavorable thermal equipment energy saving and consumption reduction, etc. Effect
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Embodiment 1
[0012] Raw material compatibility: in terms of mass percentage, 70% of synthetic mullite with a particle size of <0.074mm, 10% of alumina micropowder with a particle size of <0.074mm, 15% of silicon micropowder with a particle size of <0.045mm, and 5% of nano-ATO with a particle size of <20nm Add silica sol; wherein, the amount of silica sol is 45% of the sum of the mass of synthetic mullite, alumina micropowder, silica micropowder and nano-ATO.
[0013] Preparation method: Weigh each raw material in proportion, first place synthetic mullite, alumina micropowder, silica micropowder and nano-ATO in a closed mill for grinding, mix and co-mill until the average particle size is <0.02mm, then add silica sol and stir evenly That's it.
Embodiment 2
[0015] Raw material compatibility: In terms of mass percentage, 60% of synthetic mullite with a particle size of <0.074mm, 15% of alumina micropowder with a particle size of <0.074mm, 15% of silicon micropowder with a particle size of <0.045mm, and 10% of nano-ATO with a particle size of <20nm Add silica sol; wherein, the amount of silica sol is 50% of the sum of the mass of synthetic mullite, alumina micropowder, silica micropowder and nano-ATO.
[0016] Preparation method: Weigh each raw material in proportion, first place synthetic mullite, alumina micropowder, silica micropowder and nano-ATO in a closed mill for grinding, mix and co-mill until the average particle size is <0.02mm, then add silica sol and stir evenly That's it.
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