Low thermal-conductivity high temperature glue and preparation method thereof

A high-temperature glue, low thermal conductivity technology, applied in the field of refractory materials, can solve the problems of narrow application range, high thermal conductivity, unfavorable thermal equipment energy saving and consumption reduction, etc. Effect

Active Publication Date: 2015-12-23
郑州瑞泰耐火科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the high-temperature binder produced in the market is generally made of high-alumina fine powder with some water glass added, which can only be used as a binder for refractory materials, and its application range is narrow, and its thermal conductivity is high, which is not conducive to thermal equipment. energy saving

Method used

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  • Low thermal-conductivity high temperature glue and preparation method thereof
  • Low thermal-conductivity high temperature glue and preparation method thereof
  • Low thermal-conductivity high temperature glue and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0012] Raw material compatibility: in terms of mass percentage, 70% of synthetic mullite with a particle size of <0.074mm, 10% of alumina micropowder with a particle size of <0.074mm, 15% of silicon micropowder with a particle size of <0.045mm, and 5% of nano-ATO with a particle size of <20nm Add silica sol; wherein, the amount of silica sol is 45% of the sum of the mass of synthetic mullite, alumina micropowder, silica micropowder and nano-ATO.

[0013] Preparation method: Weigh each raw material in proportion, first place synthetic mullite, alumina micropowder, silica micropowder and nano-ATO in a closed mill for grinding, mix and co-mill until the average particle size is <0.02mm, then add silica sol and stir evenly That's it.

Embodiment 2

[0015] Raw material compatibility: In terms of mass percentage, 60% of synthetic mullite with a particle size of <0.074mm, 15% of alumina micropowder with a particle size of <0.074mm, 15% of silicon micropowder with a particle size of <0.045mm, and 10% of nano-ATO with a particle size of <20nm Add silica sol; wherein, the amount of silica sol is 50% of the sum of the mass of synthetic mullite, alumina micropowder, silica micropowder and nano-ATO.

[0016] Preparation method: Weigh each raw material in proportion, first place synthetic mullite, alumina micropowder, silica micropowder and nano-ATO in a closed mill for grinding, mix and co-mill until the average particle size is <0.02mm, then add silica sol and stir evenly That's it.

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Abstract

The invention belongs to the technical field of refractory materials, and particularly discloses low thermal-conductivity high temperature glue and a preparation method thereof. The low thermal-conductivity high temperature glue is prepared by synthetic mullite with the particle size being less than 0.074mm, alumina micro powder with the particle size being less than 0.074mm, silica powder with the particle size being less than 0.045mm, nano-ATO with the particle size being less than 20nm, and silica sol according to the mass percent. The preparation method comprises the following steps of co-grinding the synthetic mullite, the alumina micro powder, the silica powder and the nano-ATO until the average particle size is less than 0.02mm, emitting, and then adding the silica sol to stir uniformly. The product provided by the invention can be used for binding metal and metal, nonmetal and nonmetal, metal and nonmetal materials within the temperature of 800 to 1600 DEG C, and is wide in application range. The product uses the synthetic mullite as main raw materials, so that the heat conductivity coefficient of the product can be greatly reduced; meanwhile, the added nano-ATO powder body and the silica sol are melted at high temperature to form nanoscale sealed pores, so that the heat conductivity coefficient of the product is further reduced; the product has a high-temperature binding function, meanwhile, the heat insulation effect is obvious, and the energy-saving and consumption-reducing effect is improved.

Description

technical field [0001] The invention belongs to the technical field of refractory materials, and in particular relates to a low-thermal-conduction high-temperature glue and a preparation method thereof. Background technique [0002] At present, the high-temperature binder produced in the market is generally made of high-alumina fine powder with some water glass added, which can only be used as a binder for refractory materials, and its application range is narrow, and its thermal conductivity is high, which is not conducive to thermal equipment. energy saving and consumption reduction. Contents of the invention [0003] The object of the present invention is to provide a low thermal conductivity high temperature adhesive and a preparation method thereof. [0004] In order to achieve the above object, the technical scheme that the present invention takes is as follows: [0005] A low thermal conductivity high-temperature adhesive: in terms of mass percentage, it is compos...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/66
Inventor 袁林李全有李沅锦曹伟郑建立
Owner 郑州瑞泰耐火科技有限公司
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