Stress, strain or temperature abnormal area monitoring sensing element and manufacture method thereof

Abstract

The invention provides a stress, strain or temperature abnormal area monitoring sensing element and a manufacture method thereof, belonging to a sensing element and a manufacture method. The element has a basic composite layer structure and an additional composite layer structure. The basic composite layer structure is formed by a thin plate at a first layer, a sensitive element transverse array at a second layer, an insulating thin layer at a third layer, a sensitive element longitudinal array at a fourth layer, an electrode at a fifth layer and an insulation protection film at a sixth layer. The additional composite layer structure is formed by a sensitive element transverse array at a first layer and an insulation protection film at a second layer and can be added on the basic composite layer structure according to a need. According to the sensing element, the monitoring of a stress abnormal area, or a strain abnormal area or a temperature abnormal area in a two-dimensional plane field can be realized, concretely depending on the selection of a sensitive element, and a sensitive material with good strain sensitive performance is needed to be selected to manufacture a sensitive element array for strain abnormal area monitoring. The structure of the stress, strain or temperature abnormal area monitoring sensing element is simple and effective, the screen printing process is used, the method is simple and reliable, and the cost is low.

Description

technical field [0001] The invention relates to a sensing element and a manufacturing method thereof, in particular to a stress, strain or temperature abnormal region monitoring sensing element and a manufacturing method thereof. Background technique [0002] At present, the method used for two-dimensional plane stress field monitoring mainly includes the method of thin-film pressure distribution sensor. Compared with the traditional method of multi-point distribution of pressure cells, this method has certain progress, but this kind of sensor is more expensive. The methods used for two-dimensional plane strain field testing mainly include contact measurement method and non-contact measurement method. Among them, the contact measurement method mainly uses multi-point resistive strain gauges for testing. This method has limited layout and large strain gauge size. In addition, each strain gauge has to be connected to the test line, which takes up a lot of space and affects the...

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Problems solved by technology

The contact test method mainly uses multi-point thermistors or thermocouples for testing. This method has limited layout, and each thermistor must be connected to the test line, which takes up a lot of space and affects the accuracy of the test. In terms of space constraints, environmental conditions and Under the influence of equipment requirements and other factors, it is difficult to achieve effective and feasible temperature field measurement

The indirect test method mainly includes acoustic and image processing measurement methods, among which the acoustic temperature measurement technology mainly calculates the temperature of the measured medium based on the principle that the propagation speed of sound waves in the medium changes with the change of the temperature of the passing medium. The method is affected by the medium composition, reconstruction algorithm accuracy, background noise, acoustic wave interference refraction, etc., and its application is often limited; the radiation temperature measurement technology of image processing is based on the functional relationship between the object's different spectral radiation intensities and temperatures. Because the radiation is affected by the scattering and attenuation coefficient of medium particles, the application range of this test method is limited

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