A coms pixel circuit substrate recycling process
A circuit substrate and process technology, applied in the field of CMOS pixel circuit substrate recycling process, can solve the problems of non-reusability, high cost, waste disposal, etc., and achieve the effect of reducing cost, large market value and application prospect, and avoiding waste.
Active Publication Date: 2018-08-28
深圳市向阳新能源科技有限公司
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- Application Information
AI Technical Summary
Problems solved by technology
[0007] For this reason, the technical problem to be solved by the present invention is to overcome the technical bottleneck that once the CMOS pixel circuit substrate in the prior art is unqualified, it can only be discarded and wasted, it cannot be reused, it is not environmentally friendly, and the cost is high. Recycling the failed raw materials reduces the cost, and can preserve the passivation layer and circuit connection point morphology characteristics, interface state characteristics and electrical characteristics; a COMS pixel circuit substrate recycling process that conforms to the concept of energy saving and environmental protection
Method used
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Experimental program
Comparison scheme
Effect test
Embodiment 1
[0020] Embodiment 1 This embodiment discloses a recycling process of a COMS pixel circuit substrate, and the specific steps are as follows:
[0021] (1) Soaking and dissolving: prepare the solution of the following parts by weight: 25 parts by weight of tetrahydrofuran+5 parts by weight of sodium hydroxide+15 parts by weight of isopropanol+3 parts by weight of acetone+52 parts by weight of deionized water; the solution is poured into Teflon In the dragon cleaning tank, stir for 1 min; put the substrate to be recovered into the Teflon basket horizontally, put it horizontally into the cleaning tank, the liquid level should be able to completely immerse the substrate, shake the basket up and down every 5 minutes, soak for 25 minutes; take out the substrate after soaking, Rinse with deionized water and megasonic, megasonic frequency 850KHz, cleaning time 2min;
[0022] Blow dry with a high-pressure nitrogen ion air gun; observe under a microscope if there are no impurities removed...
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The invention belongs to the field of COMS pixel circuit substrates, and in particular relates to a recycling process for COMS pixel circuit substrates. The invention removes the bottom electrode, organic luminescent layer, top electrode, alumina barrier layer and PMMA barrier layer of the unqualified substrate through dissolution, chemical mechanical polishing and plasma cleaning, and keeps the passivation layer and circuit connection point intact. Appearance characteristics, interface state characteristics and electrical characteristics; recycling, avoiding the waste of materials, reducing costs, in line with the concept of energy saving and environmental protection, has great market value and application prospects.
Description
technical field [0001] The invention belongs to the field of COMS pixel circuit substrates, and in particular relates to a recycling process for COMS pixel circuit substrates. Background technique [0002] The CMOS pixel circuit substrate can be used as the pixel circuit substrate of silicon-based liquid crystal and silicon-based OLED microdisplays, which are processed on silicon wafers using CMOS technology. [0003] However, in the prior art, once the COMS pixel circuit substrate fails the inspection, it can only be discarded and wasted, and cannot be reused, which is not environmentally friendly and the cost is extremely high. Therefore, it is possible to provide a kind of COMS that can not only recycle the raw materials that failed to prepare, reduce the cost, but also keep the passivation layer and circuit connection point morphology, interface state characteristics and electrical characteristics intact; a kind of COMS that conforms to the concept of energy saving and e...
Claims
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IPC IPC(8): H01L21/77H01L21/304H01L27/32B24B1/00B24B37/04
CPCH01L21/304H01L21/77B24B1/00B24B37/04H10K59/00
Inventor 李海萍
Owner 深圳市向阳新能源科技有限公司