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A Junction Termination Structure for Lateral High Voltage Power Devices

A power device, lateral high voltage technology, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as electric field curvature effect at the connection of charge imbalance, improve the problem of charge imbalance, optimize breakdown voltage, and alleviate curvature effect of effect

Active Publication Date: 2017-11-03
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] What the present invention aims to solve is to propose a junction terminal structure for lateral high-voltage power devices aiming at the defects of traditional device charge imbalance and the curvature effect of the electric field at the junction

Method used

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  • A Junction Termination Structure for Lateral High Voltage Power Devices
  • A Junction Termination Structure for Lateral High Voltage Power Devices
  • A Junction Termination Structure for Lateral High Voltage Power Devices

Examples

Experimental program
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Effect test

Embodiment 1

[0039] like Figure 5 As shown, the structure of this example includes a linear knot terminal structure and a curvature knot terminal structure;

[0040] The linear junction terminal structure is the same as that of the active region of the lateral high-voltage power device, including the drain N + Contact region 1, N-type drift region 2, P-type substrate 3, gate polysilicon 4, gate oxide layer 5, P-well region 6, source N + Contact area 7, source P + Contact region 8, P-type buried layer 9, N-type doped layer 10; P-well region 6 and N-type drift region 2 are located on the upper layer of P-type substrate 3, wherein P-well region 6 is located in the middle, and both sides are N-type The drift region 2, and the P-well region 6 is connected to the N-type drift region 2; the two sides of the N-type drift region 2 away from the P-well region 6 are the drain N + The surface of the contact region 1, the P-well region 6 has a source N connected to the metallized source + contact ...

Embodiment 2

[0045] like Image 6 As shown, the difference between this example and Example 1 is that in this example, the junction of the P-type buried layer 9 in the linear junction termination structure and the P-type buried layer 9 in the curvature junction termination structure is located in the N-type drift region 2. The principle Same as Example 1.

Embodiment 3

[0047] like Figure 7 As shown, the difference between this example and Embodiment 1 is that the inner wall of the P-type buried layer 9 in the linear junction termination structure coincides with the inner wall of the N-type drift region 2 in the straight junction termination structure, and the P-type buried layer 9 in the curvature junction termination structure The inner wall is located in the P-type substrate 3, and the inner wall of the P-type buried layer 9 in the curvature junction terminal structure extends to the middle to connect with the inner wall of the P-type buried layer 9 in the straight-line junction terminal structure. A circle, then a straight line with a distance of e, and finally a circular arc with a counterclockwise radius of one-twelfth of r1 to make it connected to the inner wall of the P-type buried layer 9 in the straight line junction terminal structure; in the curvature junction terminal structure The distance between the inner wall of the ring-sha...

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Abstract

The invention belongs to the technical field of semiconductors, and in particular relates to a junction terminal structure of a lateral high-voltage power device. In the structure of the present invention, the inner walls of the N-type drift region 2 in the curvature junction terminal structure, the P-type buried layer 9 and the N-type doped layer 10 respectively extend to the middle to the N-type drift region 2 and the P-type buried layer in the direct junction termination structure. The layer 9 is connected to the inner wall of the N-type doped layer 10, and the extension direction is an arc path, which can relieve the curvature effect of the electric field at the connection. Secondly, the P-type buried layer 9 is a certain distance beyond the N-type drift region 2, and the P-type buried layer is 3 microns beyond the N-type doped layer 10, so as to improve the charge imbalance. The beneficial effect of the present invention is to improve the charge imbalance and electric field curvature effect of the portion connected by the straight line and the curved junction terminal structure, avoid premature breakdown, and obtain an optimized breakdown voltage.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, and in particular relates to a junction terminal structure of a lateral high-voltage power device. Background technique [0002] The development of high-voltage power integrated circuits is inseparable from the integration of lateral high-voltage power semiconductor devices. Lateral high-voltage power semiconductor devices are usually closed structures, including circular, racetrack and interdigitated structures. For the closed racetrack structure and the interdigitated structure, there will be small curvature terminations in the curved part and the fingertip part, and the electric field lines are easy to concentrate at the small curvature radius, which will lead to early avalanche breakdown of the device at the small curvature radius , which poses new challenges to the layout structure of lateral high-voltage power devices. [0003] The Chinese patent with publication number CN102244092...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L29/06
CPCH01L29/0615
Inventor 乔明代刚张晓菲王裕如方冬张波
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA