A method of manufacturing a rigid-flex board

Abstract

The invention discloses a method for manufacturing a rigid-flex PCB (printed circuit board). The method includes the following steps that S1, copper foil is cut; S2, the copper foil is coated with a cover membrane; S3, positioning is performed; S4, pressing is conducted, and the copper foil, the cover membrane, a prepreg and a rigid board are pressed; S5, cutting is carried out, the copper foil on the upper portion of the rigid board and the prepreg are cut and removed, and the rigid board below the cover membrane is removed. According to the method, the copper foil is directly coated with the cover membrane which replaces a traditional PI soft board material, so that the binding force between the copper foil and the cover membrane is high, the abnormal condition that the joint of a flex board and the rigid board is layered in the pressing process of the rigid-flex PCB is effectively avoided, and the problem that prepreg powder ejects the flex board after pressing is completed, and thus bad white spots happen to the board surface is further effectively solved; meanwhile, by the adoption of the manufacturing method, the production cost is lowered.

Description

technical field [0001] The invention belongs to the technical field of printed circuit boards, and in particular relates to a method for manufacturing a rigid-flex board. Background technique [0002] Rigid-flex board is a special printed circuit board, which is a combination of soft board and hard board. It combines a thin layer of flexible bottom layer and a rigid bottom layer, and then laminates them into a single component. Formed circuit boards are spaced rigidly and flexibly. The soft board part of the rigid-flex board is made of polyimide (PI), and the material of the outer hard board part is mainly epoxy resin board. Compared with ordinary rigid boards or flexible boards, rigid-flex boards can not only provide the support that rigid boards should have, but also have the flexibility of flexible boards, which can meet the requirements of three-dimensional assembly. [0003] The matching method of the main raw materials of the traditional rigid-flex board is mainly: s...

AI Technical Summary

Problems solved by technology

[0004] For this reason, the technical problem to be solved by the present invention is that in the prior art, when the rigid-flex board is pressed, the bonding force between the PI soft board and the prepreg is weak, and the soft and hard joints are easy to delaminate, and the prepreg powder is easy to lift the PI soft board. , so that there are white spots on the surface of the board, so a method for making rigid-flex boards with good lamination at the joint between soft and hard, not easy to delaminate, and no white spots

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