Cooling device, loading cavity and semiconductor processing device

Abstract

The invention relates to a cooling device, a loading cavity and a semiconductor processing device. The cooling device is used for cooling process workpieces completing technology and comprises a plurality of cooling discs arranged at intervals in the vertical direction. A vertical through hole is arranged in each cooling disc. The vertical through hole goes through the cooling disc. The cooling device also comprises a thimble mechanism. The thimble mechanism comprises a driving device and a plurality of thimbles. The driving device is used for driving the plurality of thimbles to move up and down through the vertical through holes in the cooling discs in the vertical direction and simultaneous cooling of a plurality of processed workpieces by the plurality of cooling discs is achieved. The provided cooling device can cool processed workpieces completing technology processing in a reaction cavity rapidly, the time, waiting for cooling, of the processed workpieces in the reaction cavity is shortened, thus the time, for technology processing of processed workpieces, of the reaction cavity is prolonged, and therefore device production efficiency and productivity can be raised.

Description

technical field [0001] The invention relates to the field of semiconductor equipment manufacturing, in particular to a cooling device, a loading chamber and semiconductor processing equipment. Background technique [0002] Physical Vapor Deposition (Physical Vapor Deposition, hereinafter referred to as PVD) is a method that uses physical methods to vaporize the surface of a material source (solid or liquid) into gaseous atoms, molecules or parts into ions under vacuum conditions, through a low-pressure gas or plasma process. , The process of depositing a film with a certain special function on the surface of the workpiece to be processed; its main realization methods include vacuum evaporation, sputtering, arc plasma plating, ion plating and molecular beam epitaxy. So far, through the above methods, not only metal films and alloy films can be deposited on workpieces, but also compounds, ceramics, semiconductors and polymers can be deposited on workpieces. [0003] figure 1...

AI Technical Summary

Problems solved by technology

[0007] In the above-mentioned PVD equipment, the number of loading chambers 3 is two, and a cooling plate 7 is arranged in each loading chamber 3, which makes the cooling plates 7 in the two loading chambers 3 cool the processed workpiece , the processed workpiece that has completed the deposition process in the process chamber 5 can only be transferred to the loading chamber 3 for cooling after the processed workpiece located on the cooling plate 7 is cooled, and, in this process, the process Chamber 5 cannot perform a deposition process on the processed workpiece, which leads to low production efficiency and production capacity of PVD equipment

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