Test fixture of light-emitting element

Abstract

The invention relates to a test fixture of a light-emitting element. The test fixture comprises a pedestal, a testing assembly and a limiting assembly. The limiting assembly is used for realizing contact between a to-be-tested light-emitting element and test probes, thereby guaranteeing good contact during testing; after test completion, the to-be-tested light-emitting element can be taken from the test fixture rapidly without damaging the to-be-tested light-emitting element, so that the to-be-tested light-emitting element can be used repeatedly and other experiments are not affected and thus the whole testing process can be realized efficiently, simply and conveniently. The corresponding test assembly also can be adjusted flexibly according to different welding plate types of to-be-tested light-emitting elements; and different limiting assemblies can be modified freely under the circumstances of giving priority to the testing efficiency or giving priority to testing accuracy, thereby meeting different testing requirements.

Description

technical field [0001] The invention relates to the field of light-emitting element testing, in particular to a light-emitting element testing jig. Background technique [0002] With the development of chips and packaging technology of light-emitting elements such as LEDs, the dot pitch between light-emitting elements is getting smaller and smaller, and the pixel density per unit area is getting higher and higher. Due to the small dot pitch of high-density LED displays, in order to ensure stable product performance and facilitate manufacturing, high-density LED displays usually use surface-mounted LED lamps. Surface-mounted LED lamps often need to use optical test fixtures to test optical parameters before mounting, such as testing light intensity, dominant wavelength, light intensity distribution curve, color temperature, color coordinates, etc., to confirm the quality of the corresponding batch. Whether the LED lamps meet the requirements for manufacturing LED display scr...

AI Technical Summary

Problems solved by technology

A common practice in the industry is to first make a PCB test board corresponding to the pad of the LED lamp, and then solder the LED lamp to the corresponding test board for circuit connection, but the high temperature during the welding process will often make the package on the surface of the LED lamp Colloids, such as epoxy glue or silica gel, will be denatured, and the discoloration will affect the corresponding optical test results of the LED

In addition, the surface-mount LED pad size is generally small. Once it is soldered to the test PCB, it is difficult to remove the LED light from the test PCB for other tests.

In addition, when testing, it is necessary to customize the corresponding test PCB board for testing a certain surface mount LED, which is time-consuming and laborious.

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