Full-automatic manufacturing method for chip winding inductors and equipment employing full-automatic manufacturing method

Abstract

The invention discloses a full-automatic manufacturing method for chip winding inductors and equipment employing the full-automatic manufacturing method, and aims at overcoming the defects of low working efficiency, complicated mechanism, large overall dimension, high cost and the like in the prior art due to the facts that a lot of lost motions are generated by reciprocating cycle operations and the time for waiting for feeding on various stations is long. According to the main points of the technical scheme, the full-automatic manufacturing method is characterized by comprising the steps as follows: a feed mechanism, a line feeding and winding mechanism, a welding mechanism, a garbage collection container and a finished product collection container are arranged on the periphery of a conveyor rotating plate with a plurality of clamping devices and a plurality of lead frames, which are alternately arranged; clamping device feeding drive mechanisms, a line pressing mechanism, a line arranging mechanism and a discharging mechanism are arranged on full-automatic equipment above the conveyor rotating plate; and specific operation processes of conveying, feeding, clamping, fixing, winding, welding, line arranging, discharging and automatic manufacturing of the chip winding inductors on ceramic cores are finished on the full-automatic equipment.

Description

technical field [0001] The invention relates to a manufacturing method and equipment for electronic components, in particular to a fully automatic manufacturing method and equipment for chip-type wire-wound inductors. Suitable for making ultra-small chip-wound inductors. Background technique [0002] Inductors are a commonly used electronic component. Chip wound inductor is a kind of higher-end product that improves the traditional inductor technology, reduces the size, and changes the lead wire to a terminal electrode structure suitable for surface mounting. It can be used in higher frequency circuit environments, such as mobile phones. and other communication products. At present, the automatic devices for producing chip-wound inductors are all imported from Japan and other countries. The structure is complex and the price is high, resulting in the high cost of domestically-produced chip-wound inductors. [0003] Chinese patent application No. 201410145342.2 discloses a...

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Problems solved by technology

[0004] In order to overcome the existing automatic inductance winding machine and its winding method, there will be many invalid movements in the reciprocating cycle operation, and the waiting time for each station to load the material is too long, resulting in low work efficiency and complicated mechanism. Large and high cost defects, the purpose of the present invention is to provide an improved fully automatic manufacturing method and equipment for chip-wound inductors, which can overcome the defects of the prior art

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