Transistor Automatic Lock Heat Sink Machine
A technology of triode and heat sink is applied in the field of triode automatic locking heat sink machine, which can solve the problems of high labor intensity, high personnel requirements and low production efficiency.
Inactive Publication Date: 2018-01-19
ACBEL ELECTRONICS DONG GUAN
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AI Technical Summary
Problems solved by technology
The traditional method of assembling the triode and the heat sink is: manually place the heat sink, manually apply glue to the surface of the triode, and manually install screws to fix the triode and the heat sink. This purely manual operation method has low production efficiency and high labor intensity. higher requirements, such as eyesight and hand flexibility
Method used
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Embodiment Construction
[0058] The present invention as Figure 1 to Figure 5 As shown, a triode automatic locking heat sink machine includes
[0059] The frame 10, the turntable material transfer device 20 installed on the frame 10, the triode feeding device 30, the glue dispensing device 40, the heat sink holding plate 50, the locking screw device 60 and the finished product transfer storage device 70, wherein,
[0060] The frame 10 is provided with a workbench 11 for installing the above-mentioned devices, and a leg 12 and a roller 13 are provided below the frame 10 .
[0061]The turntable material transfer device 20 includes a turntable 21 and a motor 22 that drives the turntable 21 to rotate. The motor 22 is a servo motor. The turntable 21 is installed on the shaft end of the motor 22. A plurality of assembly stations are arranged at intervals on the upper edge of the turntable 21. 23 , each assembly station 23 is provided with an accommodating groove 231 for accommodating a heat sink and a tri...
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The invention discloses a triode automatic locking radiating fin machine. The triode automatic locking radiating fin machine comprises a frame, a rotating disc material transferring apparatus, a triode material supplying apparatus, an adhesive dispensing apparatus, a radiating fin containing disc, a locking screw apparatus and a finished product transfer storage apparatus. The frame is provided with a workbench; the rotating disc material transferring apparatus comprises a rotating disc and a motor, and the rotating disc is provided with a plurality of assembling stations; the triode material supplying apparatus is installed beside the rotating disc and comprises a material containing disc, a vibration transfer line and a triode transfer mechanism; the adhesive dispensing apparatus comprises a cantilever support, an adhesive dispensing cylinder and an adhesive dispensing air cylinder; the radiating fin containing disc is arranged beside the rotating disc; the locking screw apparatus comprises a vertical beam, a screw driver and an elevating cylinder; and the finished product transfer storage apparatus comprises a finished product transfer mechanism and a finished product storage mechanism. In such a way, through combining the rotating disc material transferring apparatus, the triode material supplying apparatus, the adhesive dispensing apparatus, the radiating fin containing disc, the locking screw apparatus and the finished product transfer storage apparatus in an orderly manner, the efficiency of triode locking radiating fins is improved, and the qualified rate of a product is improved.
Description
technical field [0001] The invention relates to the technology in the field of triode heat dissipation, in particular to a triode automatic locking heat sink machine. Background technique [0002] Due to the integration of a large number of electronic components on the circuit board, a large amount of heat will be released during operation, causing the temperature of the circuit board to rise. If the temperature in a local area is too high, it will affect the working stability of the electronic components. Therefore, it is necessary to improve the heat dissipation effect of the circuit board and reduce the working temperature. temperature, to ensure its stability and prolong its service life. The common heat dissipation method is to install a heat sink on the circuit board, and install the electronic components that require key heat dissipation on the heat sink, quickly absorb the heat of the circuit board and electronic components through the heat sink, and transfer the hea...
Claims
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IPC IPC(8): H01L21/48
CPCH01L21/4882
Inventor 梅翔韩广辉李灿飞
Owner ACBEL ELECTRONICS DONG GUAN