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Composite phase change material heat sink of metal fiber porous skeleton and manufacturing method thereof

A composite phase change material and metal fiber technology, which is applied in the direction of electrical components, circuits, electric solid devices, etc., can solve the problem of affecting the temperature control performance of phase change heat sinks, uniformly utilize the energy storage capacity of phase change materials, and have low thermal conductivity and other problems, to achieve the effects of large latent heat of phase change, ensuring thermal control performance, and high thermal conductivity

Active Publication Date: 2016-02-03
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, when used on a large scale or in high-power devices, the inherent defect of paraffin wax itself with low thermal conductivity (only 0.1-0.3W / mK) will cause the heat absorbed from the heat source to not diffuse to the entire phase in time. Among the phase change materials, when the phase change material close to the heat source absorbs enough heat to liquefy, the rest of the phase change material is still in a solid state, and the energy storage capacity of the phase change material cannot be uniformly utilized in time and space. Seriously affect the temperature control performance of phase change heat sink

Method used

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  • Composite phase change material heat sink of metal fiber porous skeleton and manufacturing method thereof
  • Composite phase change material heat sink of metal fiber porous skeleton and manufacturing method thereof

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Embodiment Construction

[0029] In order to better understand the present invention, the specific embodiments of the present invention will be further described below in conjunction with the accompanying drawings, but the implementation method of the present invention is not limited thereto.

[0030] Such as figure 1 As shown, a metal fiber porous framework composite phase change material heat sink includes a metal fiber porous framework 4, a phase change material 2, a heat sink base 3, and a heat dissipation fin 1. The heat sink base 3 is provided with a cavity and a top The surface is provided with openings; the metal fiber porous framework 4 is sintered from metal fibers filled in the cavity of the heat sink base 3, and its porosity ranges from 75% to 98%, and is sintered into a whole with the heat sink base 3 The diameter of the metal fiber used for sintering is in the range of 50~400um, and the length is 15-30mm; the phase change material 2 is filled in the pores of the porous metal fiber framework 4...

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Abstract

The invention discloses a composite phase change material heat sink of a metal fiber porous skeleton. The heat sink comprises a metal fiber porous skeleton, a phase change material, a heat sink basal body and a cooling fin, wherein a cavity is formed in the heat sink basal body; an opening is formed in the top surface of the heat sink basal body; the metal fiber porous skeleton is sintered by metal fibers filled in the cavity; the porosity range is 75-98%; the metal fiber porous skeleton and the heat sink basal body are sintered as a whole; the phase change material is filled in holes in the metal fiber porous skeleton by a vacuum heating filling mode; the filling rate is 95-100%; and the cooling fin is sealed in an upper opening of the heat sink basal body, and is welded with the heat sink basal body as a whole. The invention further discloses a preparation method of the composite phase change material heat sink of the metal fiber porous skeleton. The heat sink is simple in manufacturing process, suitable for large-batch manufacturing and low in cost; and the metal fiber porous skeleton is embedded in the phase change material, so that the heat conducting capacity of the phase change material in the heat sink is enhanced.

Description

Technical field [0001] The invention relates to a phase change heat sink, in particular to a metal fiber porous framework composite phase change material heat sink and a manufacturing method thereof. Background technique [0002] Due to the rapid development of integration technology, electronic chips increasingly tend to be high power density and small size. The thermal management problems of electronic devices cannot be ignored. Only by stabilizing the operating temperature of the electronic devices below the critical range can the normal operating performance of the electronic devices be guaranteed. However, the traditional active cooling system of electronic devices has high operating costs due to the complexity of the system, and the complicated operating conditions lead to relatively low reliability. Therefore, passive cooling methods based on phase change energy storage materials have gradually become a hot topic in recent years. Ways to control the temperature of electro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C49/00C22C47/08C22C47/14H01L23/473
Inventor 王钒旭汤勇李宗涛陆龙生袁伟
Owner SOUTH CHINA UNIV OF TECH
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