A metal fiber porous skeleton composite phase change material heat sink and its manufacturing method

Abstract

The invention discloses a composite phase change material heat sink of a metal fiber porous skeleton. The heat sink comprises a metal fiber porous skeleton, a phase change material, a heat sink basal body and a cooling fin, wherein a cavity is formed in the heat sink basal body; an opening is formed in the top surface of the heat sink basal body; the metal fiber porous skeleton is sintered by metal fibers filled in the cavity; the porosity range is 75-98%; the metal fiber porous skeleton and the heat sink basal body are sintered as a whole; the phase change material is filled in holes in the metal fiber porous skeleton by a vacuum heating filling mode; the filling rate is 95-100%; and the cooling fin is sealed in an upper opening of the heat sink basal body, and is welded with the heat sink basal body as a whole. The invention further discloses a preparation method of the composite phase change material heat sink of the metal fiber porous skeleton. The heat sink is simple in manufacturing process, suitable for large-batch manufacturing and low in cost; and the metal fiber porous skeleton is embedded in the phase change material, so that the heat conducting capacity of the phase change material in the heat sink is enhanced.

Description

technical field [0001] The invention relates to a phase change heat sink, in particular to a metal fiber porous skeleton composite phase change material heat sink and a manufacturing method thereof. Background technique [0002] Due to the rapid development of integration technology, electronic chips tend to be more and more high power density and small size. The resulting thermal management of electronic devices cannot be ignored. Only by stabilizing the operating temperature of electronic devices below the critical range can their normal operating performance be guaranteed. However, the traditional active cooling system for electronic devices has high operating costs due to high system complexity, and relatively low reliability due to complex operating conditions. Therefore, passive cooling methods based on phase change energy storage materials have gradually become a popular in recent years. Electronic device temperature control approach. [0003] Paraffin wax, as an or...

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Problems solved by technology

However, when used on a large scale or in high-power devices, the inherent defect of paraffin wax itself with low thermal conductivity (only 0.1~0.3W / mK) will cause the heat absorbed from the heat source to not diffuse to the entire phase in time. Among the phase change materials, when the phase change material close to the heat source absorbs enough heat to liquefy, the rest of the phase change material is still in a solid state, and the energy storage capacity of the phase change material cannot be uniformly utilized in time and space. Seriously affect the temperature control performance of phase change heat sink

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