Waste treatment device for laser cutting
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SUZHOU SUNSHINE LASER & ELECTRONICS TECH CO LTD
- Publication Date
- 2016-02-17
Smart Images
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Abstract
Description
Technical field:
[0001] The invention relates to the technical field of laser drilling machines, in particular to a waste material processing device for laser cutting. Background technique:
[0002] Laser drilling is the earliest practical laser processing technology, and it is also one of the main application fields of laser processing. With the rapid development of modern industry and science and technology, more and more materials with high hardness and high melting point are used, while traditional processing methods can no longer meet certain process requirements. This type of processing task is very difficult, sometimes even impossible, with conventional machining methods, but it is not difficult to achieve with laser drilling. The laser beam is highly concentrated in space and time. Using the lens to focus, the diameter of the spot can be reduced to the micron level to obtain a laser power density of 105-1015W / cm2. Generally, a laser drilling machine is composed of ...