A plastic airtight tube shell and its manufacturing method

Abstract

The invention discloses a plastic airtight pipe shell and a manufacturing method thereof. The plastic airtight pipe shell comprises a photoelectric channel device, a pipe shell pedestal, a sealing element, a sealing bottom plate and a pipe cap, wherein the pipe shell pedestal and the photoelectric channel device are integrally formed through insert injection molding; the sealing element is arranged in the middle of the pipe shell pedestal and the sealing bottom plate, is positioned at a joint of the pipe shell pedestal and the photoelectric channel device, and is in tight integration with the outer shell surface of the photoelectric channel device; and the sealing bottom plate and the pipe shell pedestal are in tight integration through a secondary injection molding process, and the pipe shell pedestal is integrally welded with the pipe cap. By adopting the design of combining the plastic materials and non-plastic materials, the plastic airtight pipe shell is low in cost and can be produced in large batches quickly; and the manufacturing method adopts the insert injection molding technology, the secondary injection molding technology and an ultrasonic welding technology, does not require a sintering technology, has few processing steps, facilitates automatic process control, and is an effective way to achieve automated large batch production of products.

Description

technical field [0001] The invention relates to an airtight casing in the communication field, in particular to a plastic airtight casing which can be used in photoelectric integrated products and a manufacturing method thereof. Background technique [0002] With the development of optoelectronic technology, optoelectronic devices are rapidly developing in the direction of multi-functional integration, miniaturization and low cost. However, for optoelectronic device casings that require electrical connection and optical connection with the outside and require relatively high airtightness, the existing technical solutions are very limited. [0003] The electrode pins of the traditional airtight shell use metal pins wrapped with glass as an insulating layer to lead out from the base or side wall of the shell. The limitation of this structure is that when the electrode pins of the product are increased, multiple glass insulated electrode pins will Occupying a large base area o...

AI Technical Summary

Problems solved by technology

For optoelectronic device shells that require electrical connections and optical connections with the outside and require relatively high airtightness, the existing technical solutions are very limited.

[0003] The electrode pins of the traditional airtight shell use metal pins wrapped with glass as an insulating layer to lead out from the base or side wall of the shell. The limitation of this structure is that when the electrode pins of the product are increased, multiple glass insulated electrode pins will Occupies a large base area or side wall area of ​​the shell, so that high-density arrangement of electrodes cannot be realized in the design of the shell, which prevents the pace of development of shell and shell products towards integration and miniaturization

[0004] The utility model patent "A gas-tight shell for multi-element infrared detectors working at low temperature, patent No. 01255192.9", although the air-tight shell described in the electrode pin has made great improvements to the traditional shell, it can realize High-density arrangement of electrodes; however, the base and cap of the shell are made of metal, which is currently mainly formed by machining, and the cost is too high; and the base of the shell, the cap, and the electrode magnetic ring need to be sintered at a high temperature Manufacturing, and in the cost composition of shell and tube products, the sintering process accounts for a large proportion of time, so there is also the problem of high product cost. This product package contains many process steps, which is relatively complicated in mass production control and relatively difficult to control Big

[0005] The utility model "a ceramic packaging shell for hybrid integrated circuits, patent application number: 201220325544.1", the utilization of the internal space of the shell has been greatly improved on the basis of the metal packaging shell, but the ceramic packaging shell must go through the sintering process Only then can it be molded into one body, and in order to realize the effective use of the space in the cavity, the product must be designed by multi-layer superimposition, so that the product packaging process chain will be further lengthened, and the overall precision control of the product will be more difficult to further increase the production cost of the product. stay high

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