Preparation process suitable for metallization by bonding copper on aluminium oxide ceramic surface

Abstract

The present invention discloses a preparation process suitable for metallization by bonding copper on an aluminium oxide ceramic surface. The preparation process comprises the following specific steps: paste preparing, screen printing, sintering, and secondary sintering. By using the above method, and according to the preparation process suitable for metallization by bonding copper on the aluminium oxide ceramic surface provided by the present invention, two kinds of bonding copper processes in the prior art are combined, and a ceramic bonding copper method that is similar to the thick film process and low in cost is developed; a required line diagram on the ceramic part surface is printed in a manner of thick film printing; then a copper layer is obtained by air sintering and hydrogen reduction; the property of the obtained copper layer is similar to the property of that prepared by the DBC process, and the bonding strength is higher than the bonding strength of that prepared by the conventional copper thick film method; and the high requirement on a device by the DBC process and secondary chemical etching or laser etching of a copper-clad plate are avoided.

Description

technical field [0001] The invention relates to the field of ceramic devices, in particular to a preparation process suitable for copper-clad metallization on the surface of alumina ceramics, and is suitable for copper-clad products on the ceramic surface. Background technique [0002] There are two existing ceramic copper cladding methods: [0003] One is the method of thick film copper paste. The method is to prepare a slurry by adding glass powder and organic solvents into pure copper powder, and then coat it on the ceramic surface by screen printing, and then sinter it at 800-900°C under a nitrogen protective atmosphere. . However, the bonding strength between the copper-clad layer sintered by this method and the ceramic is low, and the copper layer or the ceramic is likely to fall off after welding. [0004] Another method of copper plating is to use ceramics and copper sheets to co-fire, that is, the DBC process. The method is to press an oxygen-free copper sheet o...

AI Technical Summary

Problems solved by technology

The defect of this process is that the oxygen content in the nitrogen atmosphere is difficult to control. If the oxygen content is too high, the surface of the copper layer will be oxidized. At the front end of the sintering furnace, the rear end of the sintering furnace is a pure nitrogen atmosphere

Therefore, the high requirements and high cost of equipment limit the application and promotion of this process.

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