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High-performance liquid encapsulating composition and application

A composition and high-performance technology, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of low hardness, low refractive index, poor heat resistance, etc., and achieve the effect of high hardness and high refractive index

Active Publication Date: 2016-03-02
NANJING POLYTECHNIC INSITUTE +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the disadvantages of poor heat resistance, low hardness and low refractive index of LED potting materials in the prior art, and provide a LED potting material with high heat resistance, high hardness and high refractive index

Method used

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  • High-performance liquid encapsulating composition and application
  • High-performance liquid encapsulating composition and application
  • High-performance liquid encapsulating composition and application

Examples

Experimental program
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Effect test

preparation example Construction

[0042] The preparation method of the high-performance liquid potting composition includes the following steps: weighing each component according to the formula; mixing epoxy resin, adhesion strengthening agent, ultraviolet absorber, transparent purple-blue paste and defoaming Stir the agent at 80-90°C to obtain component A; stir the acid anhydride curing agent, curing accelerator and antioxidant at 60-70°C to obtain component B; stir components A and B to obtain liquid Potting composition.

[0043] The formulations of the liquid potting compositions of Examples 1-6 are shown in Table 1.

[0044] The formula of table 1 embodiment 1-6 liquid potting composition

[0045]

[0046]

[0047] Among them, the carboxylic acid cycloaliphatic epoxy resin shown in the structural formula I adopts the aliphatic epoxy resin EPOLEADGT401, and the basic indicators: the epoxy equivalent is 220, and the viscosity is 2300mPa.s / 70°C; the carboxylic acid shown in the structural formula II The...

Embodiment 1

[0050] Example 1 The preparation method of the liquid potting composition: In a 1L four-necked flask, add 40 parts by weight of the carboxylic acid cycloaliphatic epoxy resin represented by the structural formula I and 60 parts by weight of the carboxylic acid lipid represented by the structural formula II Cyclic epoxy resin, 0.4 parts by weight of 2-hydroxyl-4-n-octyloxybenzophenone, 0.01 parts by weight of transparent purple-blue paste, 1.0 parts by weight of polyvinyl butyral, 0.2 parts by weight of defoamer, Stir evenly at 80-90°C to obtain a transparent component A; in a 1L four-necked flask, add 95 parts by weight of methylhexahydrophthalic anhydride, 0.4 parts by weight of benzyltriphenylphosphonium chloride, and 0.5 parts by weight One part of 2,6-di-tert-butyl-4-methylphenol, stirred at 60-70°C to obtain a transparent B component; A and B components were stirred at room temperature for 15 minutes at a high speed to obtain a uniform liquid Potting composition.

Embodiment 2-6

[0051] Examples 2-6 Refer to Example 1 for the preparation of the liquid potting composition.

[0052] The properties of the liquid potting compositions and their cured products prepared in Examples 1-6 were investigated.

[0053] The viscosity of the liquid potting composition before curing was measured using a rotational viscometer.

[0054] Using 1 g of the liquid potting composition, use a gelation time tester to test the gelation time of the liquid potting composition before curing.

[0055] The refractive index of the liquid potting composition before curing was measured using an Abbe refractometer.

[0056] The liquid potting composition is cured at 120°C / 1 hour, and then cured at 130°C / 1 hour, and the performance of the cured liquid potting composition is evaluated:

[0057] The glass transition temperature Tg was determined by using DSC to raise the temperature twice at a rate of 10°C / min between 30°C and 250°C in an air atmosphere.

[0058] According to the GBT934...

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Abstract

The invention discloses a high-performance liquid encapsulating composition. The composition is prepared from, by weight, 100 parts of epoxy resin, 80-120 parts of an acid anhydride curing agent, 0.1-1.0 part of curing accelerator, 0.1-1.5 parts of an adhesion reinforcing agent, 0.1-1.5 parts of ultraviolet absorbent, 0.1-1.0 part of anti-oxidant, 0.01-0.1 part of transparent purple-blue color paste and 0.1-0.5 part of an antifoaming agent. The invention further discloses application of the high-performance liquid encapsulating composition for serving as a high-power LED encapsulating material, in particular to the application of serving as a COB encapsulating material. The encapsulating composition has the advantages of being high in heat resistance, high in hardness, high in refractive index and the like, the glass-transition temperature is 155-168 DEG C, the shore hardness is D / 15: 80-89, the refractive index is larger than 1.53, and the composition is suitable for serving as the LED encapsulating material and particularly suitable for COB encapsulation.

Description

technical field [0001] The present invention relates to a high-performance liquid potting composition and its application, in particular to the application of the high-performance liquid potting composition in the field of high-power LED packaging, especially in the field of high-power integrated surface light source (COB) packaging Applications. Background technique [0002] With the rapid development of high-power packaging and white LEDs, it is more and more urgent to study high-performance LED potting materials, especially the research and development of high heat resistance, high hardness, and high refractive index LED potting materials is imminent. [0003] Compared with bisphenol A resin, the saturated alicyclic structure in the cycloaliphatic epoxy resin structure can improve the heat resistance of the cured product, which is used in low-power LED packaging, but it is not resistant to high temperatures and cannot meet the COB heat dissipation requirements. US6117953...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L29/14C08G59/42C08G59/38H01L33/56
CPCC08G59/38C08G59/4215C08L63/00C08L2201/08C08L2203/206C08L2205/025C08L2205/03C08L2205/035H01L33/56C08L29/14
Inventor 刘山张裕玲杨小燕许宁刘琴
Owner NANJING POLYTECHNIC INSITUTE
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