Epoxy pouring sealant and preparation method thereof
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A potting and epoxy technology, applied in the field of epoxy potting and its preparation, can solve the problems of toxic lead and zinc, brittle cement, etc., and achieve the effects of low curing exotherm, strong filling, and good impact toughness
Active Publication Date: 2016-03-02
TONSAN ADHESIVES INC
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Problems solved by technology
Cement is fragile and lead and zinc are toxic, so the market for epoxy potting materials is growing. However, the main criticis
Method used
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Embodiment 1
[0032] A component is made up of the following components by weight:
[0033] 16 parts of E-51 epoxy resin, 4 parts of bisphenol F epoxy resin, 2 parts of toughening agent, 3.0 parts of mixed diluent, 0.1 part of defoamer, 50 parts of spherical silica powder, and 0.05 part of fumed silica.
[0034] Component B is composed of the following components in middle parts:
[0037] A component is made up of the following components by weight:
[0038] 12 parts of E-51 epoxy resin, 8 parts of bisphenol F epoxy resin, 5 parts of toughening agent, 2.0 parts of mixed diluent, 0.3 part of defoamer, 60 parts of spherical silica powder, and 0.08 part of fumed silica.
[0039] B component is made up of the component of following parts by weight:
[0042] A component is made up of the following components by weight:
[0043] 10 parts of E-51 epoxy resin, 10 parts of bisphenol F epoxy resin, 10 parts of toughening agent, 1.5 parts of mixed diluent, 0.5 parts of defoamer, 70 parts of spherical silica powder, and 0.1 part of fumed silica.
[0044] B component is made up of the component of following parts by weight:
[0045] 96 parts of mixed amine epoxy curing agent, 4 parts of epoxy accelerator.
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Abstract
The invention relates to epoxy pouring sealant comprising a component A and a component B. When the epoxy pouring sealant is used actually, the component A and the component B are mixed in the weight ratio being 15:1, and the epoxy pouring sealant can be used after the component A and the component B are mixed uniformly. Before curing, the fluidity is good, the filling property is good, operation is simple, little heat is released during curing, the shrinking percentage of the cured epoxy pouring sealant is low, and the epoxy pouring sealant has very high compressive strength and good impact toughness, is non-corrosive and non-toxic and can be put into use after being cured for 12 h at the room temperature. The epoxy pouring sealant is suitable for supporting and reinforcing base parts and parts bearing great impact pressure, such as liner plates of breaking machines and lining plates of ball mills, the lining plates can be completely contacted with the base parts, and the bearing capacity of the epoxy pouring sealant is greatly improved.
Description
technical field [0001] The invention relates to the field of polymer materials, in particular to an epoxy potting glue and a preparation method thereof. Background technique [0002] In metallurgy, mining, chemical industry, cement and other industrial sectors, a large amount of raw materials and reused waste need to be processed by crushers every year. For example, in a concentrator, in order to separate the useful minerals in the ore, it is necessary to use a crusher to crush the raw ore to the particle size required by the grinding process. It is necessary to use crushing machinery to crush the raw materials to the particle size required by the next step. In coking plants, sintering plants, ceramic plants, glass industry, powder metallurgy and other departments, crushing machinery must be used to crush raw materials to the particle size required by the next step. With the rapid development of industry and the rapid reduction of resources, the reuse of waste materials in...
Claims
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Application Information
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