A kind of epoxy potting glue and preparation method thereof
A potting glue and epoxy technology, applied in the field of epoxy potting glue and its preparation, can solve the problems of toxic lead and zinc, brittle cement and the like
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Embodiment 1
[0032] A component is made up of the following components by weight:
[0033] 16 parts of E-51 epoxy resin, 4 parts of bisphenol F epoxy resin, 2 parts of toughening agent, 3.0 parts of mixed diluent, 0.1 part of defoamer, 50 parts of spherical silica powder, and 0.05 part of fumed silica.
[0034] Component B is composed of the following components in middle parts:
[0035] Mixed amine epoxy curing agent 90 parts, epoxy accelerator 10 parts.
Embodiment 2
[0037] A component is made up of the following components by weight:
[0038] 12 parts of E-51 epoxy resin, 8 parts of bisphenol F epoxy resin, 5 parts of toughening agent, 2.0 parts of mixed diluent, 0.3 part of defoamer, 60 parts of spherical silica powder, and 0.08 part of fumed silica.
[0039] B component is made up of the component of following parts by weight:
[0040] Mixed amine epoxy curing agent 93 parts, epoxy accelerator 7 parts.
Embodiment 3
[0042] A component is made up of the following components by weight:
[0043] 10 parts of E-51 epoxy resin, 10 parts of bisphenol F epoxy resin, 10 parts of toughening agent, 1.5 parts of mixed diluent, 0.5 parts of defoamer, 70 parts of spherical silica powder, and 0.1 part of fumed silica.
[0044] B component is made up of the component of following parts by weight:
[0045] 96 parts of mixed amine epoxy curing agent, 4 parts of epoxy accelerator.
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Abstract
Description
Claims
Application Information
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