An atomic layer deposition device and method for coating nanoparticles
An atomic layer deposition and nanoparticle technology, applied in coating, gaseous chemical plating, metal material coating process, etc., can solve the problems of limiting the utilization of nanoparticles, impairing the surface coverage and uniformity of particles, etc. Agglomeration interference, uniform deposition of atomic layers, and uniform deposition effects
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Embodiment 1
[0035] Such as figure 1 As shown, the device for the atomic layer deposition film coated on the surface of nanoparticles includes a motor 2, a reaction chamber, a holder 5 and a gas pipeline, wherein:
[0036] The motor 2 is connected with the holder 5, and is used to drive the holder 5 to rotate;
[0037] The holder 5 is located inside the reaction chamber for carrying nanoparticles;
[0038] The gas pipeline is used to input reaction gas or carrier gas into the reaction chamber;
[0039]A heating device is arranged around the reaction chamber, so that the reaction gas reacts with the nanoparticles to deposit a coating atomic layer on the nanoparticles; the reaction chamber is also connected with a vacuum pump 7, which is used to evacuate the reaction chamber.
Embodiment 2
[0041] In this embodiment, the clamper and the rotating mechanism have been further improved, such as figure 2 As shown, in this embodiment, the motor 2 is connected to the magnetic fluid 4 through the flange, the magnetic fluid 4 is connected to the cavity through the flange, the magnetic fluid 4 is connected to the holder 5 through a shaft, and there is a filter element on the top of the holder 5 12 to prevent the particles from being drawn out of the holder; the upper part of the holder is a constriction with an angle, and the bottom is a filter screen for placing particles; the holder 5 is connected to the air distribution plate 13 through threads.
Embodiment 3
[0043] Such as image 3 As shown, the atomic layer deposition method for coating nanoparticles includes the following steps:
[0044] S11: Turn on the vacuum pump 7 to make the pressure in the cavity meet the requirement of the reaction vacuum degree to ensure that the air will not affect the reaction, and the vacuum pressure is 0-10pa.
[0045] S12: Turn on the heating device to make the temperature inside the holder reach the temperature required for reactive deposition (120-200° C.).
[0046] S13: Use the flow meter 9 to feed inert gas or nitrogen into the cavity, usually the mass flow rate of nitrogen is 10sccm-100sccm, so that the particles reach the fluidization velocity, and at the same time clean the cavity to remove the residual air and water vapor inside the cavity.
[0047] S14: Start the motor at a speed of 20-100r / min, drive the movement of the holder in the cavity through the magnetic fluid sealing device, and provide additional shearing force for the particles....
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