Improved manual alignment method for solder-mask exposure of circuit board
A circuit board and anti-soldering technology, applied in chemical/electrolytic methods to remove conductive materials, printed circuits, printed circuit manufacturing, etc., can solve problems such as low efficiency and inability to confirm whether the film is aligned, and achieve high production efficiency. The effect of easy control and low investment cost
Inactive Publication Date: 2016-03-02
谢兴龙
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[0002] In the traditional manual alignment process of solder mask exposure in the PCB industry, a piece of 3M double-sided tape is pasted on each of the four corners of the exposure film, and then employees manually paste the film on the circuit board to be exposed, and then use 10 days after alignment. Visually check the effect of the alignment with a magnifying lens, and use this method for exposure. In order to meet the needs of production capacity, at least 3 employees must be arranged for an exposure machine, one of whom starts the machine and 2 people align. Only 100 pieces per hour can be exposed at most, which is inefficient, especially when the solder resist ink is black, white or other variegated inks. wash, the daily turnover rate is as high as 5-6%
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[0026] The technical features of the present invention will be described in further detail below in conjunction with the accompanying drawings so that those skilled in the art can understand.
[0027] An improved method for manual alignment of circuit board solder mask exposure, such as figure 1 and figure 2 shown, including the following steps:
[0028] A. According to the size and position of the tube hole 5 on the circuit board 4 to be exposed, the corresponding positioning hole 2 is drilled on the film 1 by a target drilling machine;
[0029] B. Insert the PIN nail 3 into the positioning hole 2, and fix the PIN nail 3 on the film 1 with glue;
[0030] C. Check the expansion and contraction ratio of the film 1 and the circuit board 4 to be exposed to ensure a complete match;
[0031] D. Fix one of the films 1 with the PIN nail 3 on the exposure machine and place the film 1SS face down;
[0032] E. Hang the circuit board 4 to be exposed on the film 1 through the pipe po...
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The invention discloses an improved manual alignment method for solder-mask exposure of a circuit board. The technical scheme provided by the invention is as follows: the improved manual alignment method comprises the following steps: manufacturing a locating hole, inserting a PIN in the locating hole, fixing the PIN on a film, respectively placing a film below, a circuit board to be exposed and a film above, taking down the film above after exposing, replacing by another circuit board to be exposed, and continuously exposing. By means of the exposure method, each exposure machine is operated only by one person; two persons can be saved; at least one hundred of boards can be exposed every hour; and furthermore, the re-development rate of poor boards is only 1-2%.
Description
【Technical field】 [0001] The invention relates to a production method of a circuit board, in particular to an improved method for manually aligning the circuit board with solder mask exposure. 【Background technique】 [0002] In the traditional solder mask exposure manual alignment process in the PCB industry, a piece of 3M double-sided tape is pasted on each of the four corners of the exposure film, and then the employees manually paste the film on the circuit board to be exposed, and then use 10 days after alignment. Visually check the effect of the alignment with a magnifying lens, and use this method to expose. In order to meet the needs of production capacity, at least 3 employees must be arranged for an exposure machine, one of whom starts the machine and 2 people align. Only 100 pieces per hour can be exposed at most, which is inefficient, especially when the solder resist ink is black, white or other variegated inks. Washing, the daily turnover rate is as high as 5-6...
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IPC IPC(8): H05K3/06
CPCH05K3/06H05K2203/052H05K2203/166
Inventor 谢兴龙
Owner 谢兴龙