A manufacturing process of a rectifier bridge and a special mold
A manufacturing process and rectifier bridge technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as increased workload, thermal expansion, chip fragmentation, etc., to improve product quality, improve internal stress, and cost low effect
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[0011] Below in conjunction with accompanying drawing and specific embodiment the present invention will be described in further detail: Figure 1 to Figure 2 As shown, a special mold for a rectifier bridge includes a plastic sealing mold, the plastic sealing mold includes an upper base 2 and a lower base 1, the lower base 1 is provided with a lower clamping mold 11, and the upper base 2 is provided with an upper Mold clamping 12, described lower clamping mold 11 is provided with some lower cutting knives 5, and described upper clamping mold 12 is provided with some upper cutters 6, and described lower clamping mold 11 is equipped with lower support 3, and described upper clamping An upper bracket 4 is installed on the mold 12, and both the upper bracket 4 and the lower bracket 3 include a frame and several copper bars arranged on the frame, and several copper guide pieces are symmetrically arranged on the copper bars.
[0012] A manufacturing process for making a rectifier br...
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