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A manufacturing process of a rectifier bridge and a special mold

A manufacturing process and rectifier bridge technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as increased workload, thermal expansion, chip fragmentation, etc., to improve product quality, improve internal stress, and cost low effect

Active Publication Date: 2018-02-23
安徽泰莱姆微电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Most of the diode packaging technology is converted from the original Taiwan-funded enterprises. There is basically no difference in various process technologies. In order to save costs and improve efficiency, it has become a trend to convert single-row diode brackets to multi-row brackets. However, multi-row brackets or matrix brackets are used in In addition to low cost and high efficiency, the internal stress of the inherent matrix structure is much greater than that of the monolithic structure during packaging, which seriously affects product quality and brings huge hidden dangers.
However, due to the intensive packaging of products in the matrix structure, the increase of process ribs, the increase of the single chip area, and the difference in shrinkage between the plastic packaging compound and the copper bracket, the internal stress formed is much greater than that of the single-row structure. Generally, manufacturers use reflow ovens for similar steel Annealing process to eliminate internal stress, the effect of this process is not ideal, and increases the workload
The original matrix bracket is composed of upper and lower pieces, which are connected to the frame after being drawn into a matrix. From this, the entire matrix bracket technology is criss-crossed. After being packaged in a plastic package at a high temperature of 160-180 degrees and then cooled to room temperature, the internal stress cannot be effectively released. Multiple rows of cutters are cut and extruded, and the internal stress is mainly concentrated inside the plastic package body. Since the internal structure of the diode is a copper bracket chassis and the chip is connected with solder, the device heats up and expands during operation and then cools down. The early stress is released in large quantities, causing the chip to be damaged. The force is damaged, resulting in defects. When the defect is serious, the chip can be broken

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  • A manufacturing process of a rectifier bridge and a special mold
  • A manufacturing process of a rectifier bridge and a special mold

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Embodiment Construction

[0011] Below in conjunction with accompanying drawing and specific embodiment the present invention will be described in further detail: Figure 1 to Figure 2 As shown, a special mold for a rectifier bridge includes a plastic sealing mold, the plastic sealing mold includes an upper base 2 and a lower base 1, the lower base 1 is provided with a lower clamping mold 11, and the upper base 2 is provided with an upper Mold clamping 12, described lower clamping mold 11 is provided with some lower cutting knives 5, and described upper clamping mold 12 is provided with some upper cutters 6, and described lower clamping mold 11 is equipped with lower support 3, and described upper clamping An upper bracket 4 is installed on the mold 12, and both the upper bracket 4 and the lower bracket 3 include a frame and several copper bars arranged on the frame, and several copper guide pieces are symmetrically arranged on the copper bars.

[0012] A manufacturing process for making a rectifier br...

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Abstract

The invention discloses a special mold for a rectifier bridge, comprising a plastic sealing mold, wherein the plastic sealing mold includes an upper base and a lower base, the lower base is provided with a lower clamping mold, and the upper base is provided with an upper clamping mold. A number of lower cutting knives are arranged in the lower clamping mold, a number of upper cutting knives are arranged in the upper clamping mold, a lower bracket is installed on the lower clamping mold, an upper bracket is installed on the upper clamping mold, and the upper bracket is installed. Both the lower bracket and the frame include a frame and a plurality of copper bars arranged on the frame, and a plurality of copper conductors are symmetrically arranged on the copper bars. Compared with the prior art, the present invention can improve the internal stress of the product and improve the quality of the product, which is beneficial to make the subsequent matrix frame larger, with higher efficiency and lower cost.

Description

technical field [0001] The invention relates to the field of rectifier bridge manufacture, in particular to a rectifier bridge manufacture process and a special mold. Background technique [0002] The rectifier bridge is to seal the rectifier tube in a shell. Divided into full bridge and half bridge. The full bridge seals the four diodes of the connected bridge rectifier circuit together. The half bridge is to seal the half of two diode bridge rectifiers together. Two half bridges can be used to form a bridge rectifier circuit. One half bridge can also form a full wave rectifier circuit with a transformer and a center tap. The rectifier bridge should be considered Rectifier circuit and working voltage. [0003] In 2015, affected by the continuous downturn in the global semiconductor market, the price of finished rectifier diodes declined rapidly, but the price of raw materials did not decrease accordingly, and labor costs continued to rise again, resulting in a sharp redu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/56H01L21/67
Inventor 孙龙海
Owner 安徽泰莱姆微电子科技有限公司