Packaging structure of light receiving/ transmitting sub module and manufacturing method thereof

Abstract

The invention relates to a packaging structure of a light receiving / transmitting sub module. The packaging structure comprises an arrayed waveguide grating chip, an optical fiber pigtail assembly and a photo-electric / electro-optic conversion circuit board, wherein one end face of the arrayed waveguide grating chip is ground to form a ground angle of more than 10 degrees, and the photo-electric / electro-optic conversion circuit board is horizontally placed below the arrayed waveguide grating chip; and the optical fiber channel of the optical fiber pigtail assembly is correspondingly connected with a waveguide channel on the other end face of the arrayed plane waveguide grating chip through an optical fiber. One end face of the arrayed waveguide grating chip is machined to form a certain reflective angle and then directly coupled with an arrayed photo-electric diode or a laser chip on the photo-electric / electro-optic conversion circuit board to manufacture the light receiving / transmitting sub module, and only one optical fiber pigtail assembly is needed, so that the overall structure is simple, the loss is low and the cost is low; the process flow is simplified in the method of coupling with spatial light reflection, the operation is convenient, and the packaging structure is suitable for batch production.

Description

technical field [0001] The invention relates to a light receiving / transmitting sub-module in the field of optical fiber technology, in particular to a package structure of a light receiving / transmitting sub-module and a preparation method thereof. Background technique [0002] With the accelerated development of the Internet, cloud computing and big data industries, the huge demand for bandwidth from the growing IPTV and video game services is driving the development of broadband technology. High-speed and compact optical transceiver modules have become a common demand for optical communication equipment manufacturers and data centers. The optical receiving / transmitting sub-module (referred to as "ROSA / TOSA") is the core device in the optical transceiver module and has broad market prospects. [0003] The light receiving / transmitting sub-module is mainly assembled by arrayed waveguide grating chip, array photodiode or laser chip, input end and output end fiber pigtail assem...

AI Technical Summary

Problems solved by technology

Two optical fiber arrays are usually used in the traditional optical receiving sub-module. An optical fiber array is assembled at the input end of the arrayed waveguide grating chip, and then an optical fiber array is assembled at the output end of the arrayed waveguide grating chip and coupled with the array photodiode. Therefore, The structure is more complicated and the cost is higher; especially, the optical fiber array coupled with the photodiode array is exposed and easily broken and damaged, so the operability is relatively poor and cannot meet the needs of batch operation; and the use of two After the optical fiber array, the performance index loss of the product will increase

Similarly, one or more laser chips in the traditional light emitting sub-module need to be coupled to the optical fiber and then output. Multiple optical fibers are assembled into a fiber array and connected to the arrayed waveguide grating chip. The structure is also complex, the volume is large, and the operability is poor.

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